Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference

Event brings together more than 400 companies from across the world

The 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.

The two-day event brought together more than 400 companies and 600 industry representatives from across China and around the world. Centered on the theme “Shaping a Sustainable Future,” the conference highlighted major industry achievements, unveiled new initiatives, and fostered in-depth discussions on the future of global electronics manufacturing.

Conference highlights:

  • Upcoming New Standard – IPC-6921, Requirements and Acceptance for Organic Substrates for Packaging Applications, scheduled for release by the end of 2025.
  • Intelligent Manufacturing Demonstration Projects – Presenting best practices in digital transformation standards and solutions.
  • Electronics Industry ESG Cooperation Initiative – Officially launched, along with a survey report identifying the top ESG issues and challenges facing electronics enterprises.
  • Industry Recognition and Awards – Leading companies and industry experts honored for their outstanding contributions.

Voices from the Conference

Sydney Xiao, president of Global Electronics Association East Asia, remarked, “We sincerely thank all our partners for their active participation and strong support. CEMAC is not only an annual conference but also an open and collaborative platform where ideas are shared, achievements are showcased, and partnerships are forged.”

In his closing address, Dr. John W. Mitchell, president and CEO of the Global Electronics Association, emphasized, “Innovation drives our industry, and resilience safeguards our future. Through collaboration, we will continue to lead the electronics industry toward a smarter, more connected, and more sustainable future.”

Outlook

The 2025 IPC CEMAC showcased the latest progress in standards, technology, talent, and supply chain resilience, while injecting fresh momentum into global collaboration. The outcomes of the conference are expected to accelerate the high-quality development of China’s electronics sector and contribute to the sustainable growth of the worldwide electronics industry.

WHMA Survey Identifies Top Priorities: Design Quality & Automation Lead the Way

Survey informs wire harness industry needs and positioning at the forefront of technological advancement

The Wiring Harness Manufacturer’s Association (WHMA), a council of the Global Electronics Association, today announced the results of an industry survey, revealing the need for systems to catch and collect errors to ensure design quality and automation to create efficiencies and reduce risk. 

Cable and wire harness protect the collection of wires and cables in vehicles and other complex systems to ensure the safe and efficient transmission of electricity. A global industry, estimates value the market at $99.59 billion in 2024 and it is projected to reach $147 billion by 2034[1]

Conducted by WHMA’s newly formed Innovation Advisory Team (IAT), the survey demonstrates the most pressing challenges and opportunities shaping the industry’s future. The IAT, co-chaired by Arik Vrobel, CEO of Cableteque, and George Jacob, Director of Etron Systems, brings together leading voices from MBDA-Systems, LCMO, RocketlabUSA, Rivian, KomaxGroup, Protronics, ECI International, Motherson and Qualtronics. They will use these survey insights to guide actionable strategies, foster industry-wide collaboration, and support members as they adapt to evolving demands.

Top five priorities identified 

  1. Design Quality and Customer Error Management
    Validating customer designs before manufacturing was ranked the highest innovation priority (52.4%), reflecting the need for systems to catch and correct errors early. 76% of respondents report encountering customer design errors “sometimes” or “often.” 

  2. Process Speed and Automation
    Nearly 74% describe their quoting process as “manual, time-intensive, and too slow.” Respondents rated automated bill of materials enhancement (4.50/5) and faster quoting tools as critical, underscoring the role of speed-to-quote as a competitive advantage.

  3. Knowledge Capture and Standardization
    Over 57% of organizations rely on tribal knowledge for quoting, while 50% face challenges with incomplete or inaccurate customer information. Respondents emphasized the need for better documentation and standardized processes to reduce risk and improve consistency.

  4. Digital Tool Integration and Modernization
    While more than 75% expressed interest in adopting digital platforms, barriers include cost (64.3%) and system compatibility (57.1%). With 47.6% still relying on basic Excel or Word-based tools, the data points to significant opportunities for digital transformation.

  5. Workforce Development and Training
    Skills gaps hinder technology adoption for 45.2% of respondents. More than half (51.2%) said they need access to training programs, and 64.3% expressed interest in WHMA-backed standardized tools, highlighting the importance of workforce development and certification.

“These results clearly reflect an industry in transition, moving away from traditional, manual approaches toward digitization, standardization, and workforce development,” said Arik Vrobel, IAT Co-Chair and CEO of Cableteque. “By focusing on these priorities, WHMA and our members can help shape a more efficient, innovative, and resilient wire harness industry.”

WHMA is looking for industry subject matter experts that can help drive positive change to solve the challenges identified in the survey results.  Companies interested in participating can email WHMA Executive Director David Bergman at DavidBergman@electronics.org.


 

Monitoring the Pulse of the Global Electronics Industry July 2025

Persistent Cost Pressures Offset by Solid Demand Conditions: The global electronics manufacturing supply chain remains under pressure from rising input costs,
with 61% of firms reporting higher material costs and 54% noting increased labor expenses. While the Material Cost Index dipped slightly from June and profit margins showed a modest gain (+6 points), only 15% of manufacturers reported actual profit improvement, highlighting the fragility of recovery in margins.

  • Demand Fundamentals Remain Strong Despite Volatility: Operational metrics such as orders, shipments, backlogs, and capacity utilization continue to signal expansion,
    maintaining momentum from the rebound that began in late 2024.
  • Regional Divergence Becomes More Pronounced: Manufacturers in APAC are outpacing their North American and European peers across several dimensions. Half of APAC-based firms report rising profit margins, compared to just 5% in North America.

Similarly, a greater share of APAC firms are experiencing relief in material costs and anticipate future declines in labor costs, an outlook not shared by North American firms, where cost pressures remain more entrenched.

  • Hiring Efforts Widespread but Talent Scarcity Constrains Growth: Sixty percent of firms are actively hiring, with European companies more likely to be pursuing talent for critical roles. Yet across all regions, the ability to secure skilled workers is a key limiting factor, 63% of firms report that talent shortages are constraining business growth, reinforcing labor as a critical operational challenge.
Author(s)
Global Electronics Association
Resource Type
Economic Reports
Event
No Event

Real-World Training in Action: How Milwaukee Electronics & LSI Leverage Training to Boost Performance

Date

Join us for a panel-driven discussion featuring real practitioners from Milwaukee Electronics and LSI ADL Technology, sharing how they’ve translated workforce training into tangible improvements across their operations.

Winners of Hand Soldering and Wire Harness Competitions Announced at NEPCON Vietnam 2025

In conjunction with NEPCON Vietnam 2025, the Global Electronics Association hosted its popular Hand Soldering Competition on September 11–12, 2025, and the Northen regional round of the Wire Harness Competition on September 10, 2025, in Hanoi, Vietnam.

This year’s Hand Soldering Competition featured 38 contestants from 15 companies, representing both leading foreign direct investment (FDI) manufacturers and local Vietnamese enterprises. Notably, for the first time in the competition’s history, a contestant from a small domestic enterprise claimed the top prize. Skilled contestants were challenged to build a functional electronics assembly within a limited time, judged on soldering quality in accordance with IPC-A-610J Class 3 criteria, production speed, and overall electrical functionality.

Winners of the Hand Soldering Competition:

  • First Place: Phạm Văn Tuyền, EZ2DO Company Limited – Achievement Certificate, USD $300, and an Intelligent Portable Soldering Iron from Platinum sponsor QUICK. He also qualified for the IPC Hand Soldering World Championship in Munich, Germany, November 2025.

  • Second Place: Lê Thị Thu, Spartronics Vietnam Co., Ltd. – Achievement Certificate and USD $200.

  • Third Place: Lê Đức Nhã, UMC Electronics Vietnam Limited – Achievement Certificate and USD $100.

The Wire Harness Competition Vietnam drew 27 participants from 13 companies, demonstrating proficiency in wire harness assembly under IPC/WHMA-A-620 Class 3 standards, the highest benchmark of workmanship in the electronics industry. Contestants were tasked with building a functional harness assembly within a set timeframe, judged on both process quality and final workmanship.

Winners of the Wire Harness Competition:

  • South Regional Winner: Nguyen Minh Thuan, Thermtrol (VSIP) Co., Ltd.

  • North Regional Winner: Pham Van Thao, Vietkai Company Limited

The overall Vietnam Champion title was awarded to the Northern Region winner, Mr. Pham Van Thao from Vietkai Company Limited. He completed the assembly in five minutes less than the Southern Region winner, with the same score. He received a trophy and Achievement Certificate and earned the opportunity to represent Vietnam at the Wire Harness World Championship during the Integrated Electronics Manufacturing & Interconnection (IEMI) event in Bengaluru, India, January 29–30, 2026.

This year’s competitions were made possible through the generous support of sponsors:

  • Platinum Sponsor QUICK INTELLIGENT EQUIPMENT

  • Gold Sponsors NIHON SUPERIOR and SOLDERINDO

These competitions continue to highlight Vietnam’s growing electronics manufacturing talent and provide a platform for local and international companies to showcase excellence in workforce skills and industry collaboration.

Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration

The Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more. The Association's upcoming conferences and tradeshows connect leaders, engineers, and technologists with the solutions and insights they need most.

“From design to assembly to recycling, no single company or industry sector can achieve progress in isolation,” said John W. Mitchell, Global Electronics Association president and CEO. “Our Association provides the forums where critical conversations happen, connections are made, and the future of the industry is shaped.”

The Association’s upcoming events include:

  • IPC CEMAC – September 25-26, Shanghai – This year’s conference, themed “Shaping a Sustainable Future,” will address critical advancements in AI-enabled digital transformation, next-generation packaging technologies, PCB/PCBA process innovations, and ESG-driven sustainability practices. The program is designed to strengthen cross-border collaboration and accelerate technology development that underpins the long-term resilience and sustainable growth of the global electronics industry.
  • Pan-European Electronics Design Conference (PEDC) – January 21-22, 2026, Prague, Czech Republic – Co-organized with Fachverband Elektronikdesign und -fertigung e. V. (FED), the technical conference addresses the industry’s pressing design challenges. Featuring peer-reviewed presentations, attendees gain access to cutting-edge research on silicon-to-systems integration, proven Design for Excellence (DfX) methodologies, and sustainable design frameworks that meet new EU regulations. The conference is limited to 400 participants to ensure meaningful networking and direct access to presenting experts.
  • Integrated Electronics Manufacturing & Interconnections (IEMI) – January 29-30, 2026, Bengaluru, India – India’s premier electronics event features the World Wire Harness Competition, vendor development workshops, one-to-one business matchmaking, educational sessions, and a product showcase.  
  • APEX EXPO – March 14-19, 2026 – Anaheim, Calif. – North America’s largest electronics industry gathering expects more than 400 exhibitors and 7,000 attendees. OEMs, EMS providers, PCB manufacturers and industry professionals from around the globe come together to access the latest technical content, contribute to standards development, and take part in exclusive product and service launches and the Design Village, where next-generation advanced electronic packaging and system co-design come to life. Pre-conference professional development workshops on March 15-16 offer technical training and the Learning Lounge with workforce training and certification tracks takes place, March 17-19.
  • EWPTE (Electrical Wire Processing Technology Expo) – May 5-7, Milwaukee, Wisc. – The leading event for wire harness, cable, and connector technologies, delivering hands-on technical training and access to top-tier suppliers and innovations.

Added Mitchell, “In an industry where technological advances and supply chain resilience are crucial to success, these events provide the connections, partnerships, and knowledge that drive measurable business results and help address shared challenges.  

Register now at electronics.org/events or contact events@electronics.org for group discounts. Follow @GlobalElectronicsAssociation on LinkedIn for real-time updates and speaker announcements.