Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs

We are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.

These tariffs will hit U.S. printed circuit board (PCB) fabricators especially hard by raising the cost of a critical input that can make up 60% of a PCB’s value, much of which is etched away in the production process. With no scalable domestic supply, U.S. electronics manufacturers will face higher costs, delay investments, and potentially even cut jobs, jeopardizing U.S. competitiveness in the technologies that will power the 21st century.  

This move directly undercuts President Trump’s goal of rebuilding American manufacturing and promoting American exports in strategic sectors. We urge the Administration to exempt electronics-grade copper and adopt policies that lower costs, encourage domestic production, and strengthen the U.S. electronics supply chain.

Brent Laufenberg Appointed CIO of the Global Electronics Association, Advancing Technology and Member Services

The Global Electronics Association (formerly IPC International Inc.) announces the appointment of Brent Laufenberg as its new Chief Information Officer (CIO). 

As CIO, Laufenberg will serve as a strategic partner to the CEO and executive leadership team, overseeing the implementation of a modern IT infrastructure and advancing the Association’s vision to become a data-informed and AI-accelerated global organization.               

“Brent brings a rare combination of technical expertise, strategic vision, and deep understanding of how to use technology as a driver of business value,” said John W. Mitchell, Global Electronics Association president and CEO. “His leadership will be instrumental as we enter a new chapter focused on leveraging AI, data, and digital tools to serve our members in smarter, more personalized, and more impactful ways.”

Laufenberg’s priorities will include:

  • Technology Strategy & Execution: Crafting and implementing a business-aligned technology roadmap that supports growth and delivers a competitive advantage for members.

  • AI & Data Innovation: Championing AI adoption and building a data-driven culture to enhance decision-making, productivity, and insight.

  • Member Experience Transformation: Leading the development of intuitive, personalized digital platforms that elevate member engagement and satisfaction.

  • Organizational Enablement: Inspiring cross-functional collaboration and embedding technology as a strategic accelerator across the association.

  • Security & Risk Management: Ensuring a secure, compliant, and resilient technology environment.

  • Operational Efficiency: Managing IT investments and partnerships to deliver measurable value and performance.

“As the global electronics industry and supply chain continues to evolve, we have a responsibility to match that transformation in how we support our members,” Laufenberg said. “Every member experience—whether it’s training and certification, seamlessly leveraging our standards, gaining deeper industry insights, or creating new technology solutions to accelerate innovation—should be intuitive, personalized, and undeniably valuable. I’m excited to join the Global Electronics Association at such a pivotal time and look forward to helping expand the impact we can make through smart, strategic use of technology.”                                                                      

Laufenberg joins the Association with more than two decades of technology leadership experience in complex, global organizations, most recently serving as chief technology officer at Rise, an omnichannel media agency. “Brent’s proven ability to lead digital transformation and his passion for innovation will be instrumental as the association continues to evolve to meet the needs of the global electronics industry,” added Mitchell.                                                    

Laufenberg works from the headquarters office in Bannockburn, Ill., and can be reached at BrentLaufenberg@electronics.org.

Onshoring Advanced Packaging and Assembly

Date
-

An IMAPS/Global Electronics Association Workshop Focused on Increasing Domestic MicroelectronicS Production

 

Hosted by IMAPS and Global Electronics Association, the Onshoring Advanced Packaging Workshop brings together the U.S. Government, DIB (Defense Industrial Base), and key stakeholders to drive microelectronics packaging and assembly onshoring. Discover emerging government‑led advanced packaging initiatives and collaborate with suppliers, researchers, and integrators to strengthen the Advanced Packaging Supply‑Chain Onshoring ecosystem in America.  The mission of this workshop is to engage our workforce community to identify the newly created Advanced Packaging programs which address US Government and Defense requirements critical to the onshoring of the microelectronic assembly and packaging supply chain.  Government agencies including the Department of Commerce/NIST, DoD (SHIP/IBAS/Title III), and DARPA will be briefing on their advanced packaging programs.
 

Attendees for the Workshop MUST be U.S. Citizens with a current and valid U.S. passport for those days/program areas noted.  

Region
Sheraton Pentagon City Hotel

900 South Orme Street
Arlington, VA 22204
United States

Sheraton Pentagon City Hotel

Sheraton Pentagon City Hotel
900 South Orme Street
Arlington, VA 22204
United States

North American EMS Industry Down 8.9 Percent in June

The Global Electronics Association releases EMS industry results for June 2025

The Global Electronics Association announced today the June 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.28.

Total North American EMS shipments in June 2025 were up 3.0 percent compared to the same month last year. Compared to the preceding month, June shipments were up 2.4 percent. June’s year-to-date (YTD) shipments decreased by 0.3% year-over-year (YOY).

EMS bookings in June decreased 8.9 percent year-over-year and decreased 17.4 percent from the previous month. June’s YTD bookings increased by 0.2% compared to the same period last year.

“June was a steady, solid month for North American EMS providers, signaling continued forward momentum,” said Shawn DuBravac, Ph.D., the Global Electronics Association’s chief economist. “While bookings declined nearly 9 percent year-over-year, shipments rose almost three percent, highlighting the sector’s strength in meeting current demand and maintaining a healthy production environment.”

June 2025 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. The Association publishes the EMS book-to-bill ratio by the end of each month.

North American PCB Industry Sales Down 8.6 Percent in June

The Global Electronics Association releases PCB industry results for June 2025

The Global Electronics Association announced today the June 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.06.

Total North American PCB shipments in June 2025were down 8.6 percent compared to the same month last year. Compared to the preceding month, June shipments were down 19.2 percent. June's year-to-date (YTD) shipments increased by 5.3% year-over-year (YOY).

PCB bookings in June were up 4.9 percent compared to the same month last year. June bookings were down 2.1 percent compared to the preceding month. June’s YTD bookings increased 16.2% compared to the same period last year.

“June’s results reflect continued resilience in North American PCB production. The data signals stable demand and ongoing confidence in future output,” said Shawn DuBravac, Ph.D., IPC’s chief economist. “While flex bookings softened slightly, strong rigid bookings helped sustain the sector’s positive momentum."

June 2025 PCB book to bill ratio chart 1

 

June 2025 PCB book to bill ratio chart 2

 

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. The Association publishes the PCB book-to-bill ratio by the end of each month.

IPC Standards European Committee/Task Group Meetings

Date
- (3:59 - 11:00am CDT)

IPC Standards European Committee Meetings are located at Hotel NH Collection Munchen Bavaria, Arnulfstrasse 2, Munich, Germany. 

We are seeking your valuable input and participation at this year's meetings. IPC standards are developed for the industry by the industry. Any interested person can join at no cost, volunteering their time and efforts in building a stronger community of electronics manufacturers, OEMs, and suppliers. Help us drive the electronics industry forward by participating in any committee of your expertise. We ask you to register so that we have a reasonable count to manage meeting rooms.

IPC Standards and Task Groups - 

  • IPC-Hermes-9852 Task Group
  • IPC-A-610 and J-STD-001 Task Group - Europe
  • IPC-CFX Standard Task group
  • Cybersecurity Protection Standard Task group
  • European Training Group
  • critical Components Traceability and Digital Credential Exchange Task Groups
  • Automated Inspection Process Standards Task Group
  • Sustainability Reporting and CO2e Calculations Task Group
  • Materials Declaration Subcommittee
  • Plastronics Accelerated Reliability Test Task Group
  • Cool Joining Press-Fit Task Group 

Download Meeting Details 

There is no cost to join the meetings. 

Hotel in Munich

We are holding room blocks for your convenience in the following hotels:

  • NH Collection München Bavaria – 4 nights (October 26 to 30), 252€ per night, breakfast included – 8 rooms available
  • Mio by Amano - 4 nights (October 26 to 30), 219€ per night, breakfast included – 16 rooms available
  • 25Hours - 4 nights (October 26 to 30), 195€ per night, breakfast included – 8 rooms available
  • 25Hours - 4 nights (October 26 to 30), 221€ per night, breakfast included – 8 rooms available

All rooms are available until October 20.

 

If you should have additional questions, contact Andres Ojalill, andresojalill@electronics.org

 

Region
Hotel NH Collection Munchen, Germany

Arnulfstrasse 2
80335 Munchen
Germany

Hotel NH Collection Munchen, Germany

Hotel NH Collection Munchen, Germany
Arnulfstrasse 2
Munchen, 80335
Germany

How Artificial Intelligence (AI) Helps on Automated X-ray Inspection (AXI) Process

Member Download (pdf)

The use of inspection systems in production has increased as manufacturers use automated inspection technologies to capture defects in the production process. The benefits of utilizing the inspection systems include optimized production line operation, reduced labor and resource consumption, and an overall increase in yield and quality improvement.
The AXI (Automated 3D X-ray inspection Solution) enables manufacturers to inspect hidden defects and solder joints that SPI and AOI systems cannot see or capture. Due to technological evolution, more and more unique packages appear in the market, further increasing the challenges in this field. Therefore, Artificial Intelligence (AI) has been introduced into inspection equipment, including implementing AI during programming, image reconstruction, programming validation, inspection or classification, and buy-off stages. The AI stands at the forefront of technological innovation, offering many advantages across diverse domains. One of its primary benefits lies in automation, streamlining routine tasks, and freeing human resources for more intricate and creative endeavors. The 24/7 availability of AI systems ensures uninterrupted services in sectors like customer support. This significantly impacts the production environment regarding efficiency, accuracy, and effort reduction, while AI often leads to substantial cost savings over the long term.

Author(s)
Chong Wei Chin, Lim Lay Ngor, Chew Kok Wei, Hee Wei Ken
Resource Type
Technical Paper
Event
IPC APEX EXPO 2024

Technical Research for PCB Design Solution of High Efficiency Thermal Dissipation

Member Download (pdf)

With the high power density and miniaturization of electronic products, printed circuit boards need to have more efficient thermal dissipation. In the thermal design of printed circuit board, more attention will be paid to the overall thermal dissipation of high-power products, usually ignoring its contribution to thermal dissipation itself. According to the demand of terminal electronic products, this article has systematical study to the thermal conductivity materials, the whole thermal dissipation structure, the selection of power devices and the thermal simulation technology, to get the optimal thermal dissipation solution under different heat flow density and working conditions. And design thermal dissipation PCBs with different thermal dissipation grades according to the thermal conductivity requirements of high power products, which can be defined as five grades with T/C from 1W/(m*K) to 800W/(m*K). It needs to match with different thermal dissipation PCB solution for different thermal design & different method of power device package to meet the needs of products of thermal dissipation characteristics.
Key words Thermal dissipation PCB, IMS, High thermal conductivity IMS, inlay, Diamond copper, IMS radiator integration; thermoelectric separation substrate

Author(s)
Wang Jun, Wang Yuan, Luo Qi, Zhang Feilong, Huang Yizhao, Kuang Meijuan
Resource Type
Technical Paper
Event
IPC APEX EXPO 2024

Applying Hierarchical Machine Learning Forecast to Manufacturing Process Sequences Topic/Category: Factory of the Future OR Emerging Technologies

Member Download (pdf)

It has been demonstrated it is possible to combine design, process, and metrology information to create machine learning models that accurately predict the behavior of individual products in the manufacturing line. In this work, we extend the application of these single process models to a full production sequence. Instead of training a large machine learning model to describe the full production sequence, we sequentially train the models in a way that prior models can be used to impute the sparse manufacturing data of previous process steps. This approach uses process and context-aware methods to effectively augment real-world facility data that is otherwise expensive to collect. By doing so, it is possible to identify which process steps have the most impact. While the primary work was validated in the final electrical test after a Back-End-Of-Line process, the methods used have been demonstrated to work in packaging operations. Two of the challenges to apply machine learning methods to manufacturing processes, are the complexity and heterogeneous nature of each individual unit operation, as well as the lack of complete characterization for every single item being produced due to throughput and cost constraints. In this work we demonstrate the benefits of using a hierarchical approach to product manufacturing in which individual unit operations are modelled individually, but results of previous operations inform and forecast subsequent manufacturing processes. To demonstrate this methodology, we have selected a portion of a Semiconductor manufacturing process, composed by over 40 distinct unit operations.

Author(s)
J. Andres Torres, Nathan Greeneltch, Melody Tao, Srividya Jayaram, Mohan Govindaraj, Anastasiia Doinychko,
Resource Type
Technical Paper
Event
IPC APEX EXPO 2024