PCB Design for Signal Integrity

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Class meets Monday and Wednesday

Design high-speed PCBs that maintain signal integrity, reduce noise, and perform reliably under real operating conditions.
Develop the ability to control impedance, manage stackups, and apply routing and power distribution strategies that prevent signal degradation. Understand how materials, layout decisions, and transmission line behavior impact performance so your designs meet speed, reliability, and quality requirements from prototype through production.

Introduction to PCB Design II

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Tuesday and Thursday  6:30-8:30pm EST

Apply layout strategies, material selection, and design rules that support signal integrity, reliability, and manufacturability. Build the ability to manage multilayer routing, control impedance, reduce EMI, and generate complete manufacturing documentation so your designs perform as intended and are ready for production without delays.

Global Electronics Association to Testify at the Office of the US Trade Representative Panel on Section 301 Structural Excess Capacity

Industry Expert Chris Mitchell Available for Interviews

Chris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the Office of the U.S. Trade Representative (USTR) Panel on Section 301 Structural Excess Capacity on Friday, May 8. He will emphasize that policymakers should carefully distinguish between unfair state-directed industrial overcapacity and the commercially necessary manufacturing capacity that underpins the global electronics industry — including production among U.S. allies and partners.

“The problem is not capacity but rather the source of that capacity. Capacity built through state-directed industrial policy that distorts markets is a genuine trade concern. Capacity built by the basic economics of electronics manufacturing, where firms must invest billions before the first product ships, is not. Conflating the two causes the finding to collapse into circular logic: if capacity exists, it is structural, and therefore it is distortive,” Mitchell shared ahead of his official testimony.

Mitchell will testify alongside more than 100 witnesses representing a wide variety of industries and national interests.

Media Availability: Mitchell will testify during Panel 21 on Friday, May 8, with the day’s testimonies beginning at 10:00 am ET. He is available for background briefings ahead of the hearing and on-the-record interviews afterward. To schedule an interview or request the full testimony, contact Daniel Baker (danielbaker@electronics.org), Director of Policy Communications & Public Affairs.

Mitchell’s full testimony will touch on the following topics:

  • Distinguishing allied production from state-directed competition.
  • The cyclical nature of electronics production.
  • Why specialization and geographic concentration occur in the sector.
  • The need for a rigorous evidentiary standard.
  • Why tariffs alone cannot solve domestic capacity constraints or limitations. 

About Chris Mitchell 

Chris Mitchell leads global government relations for the Global Electronics Association, representing the world’s leading electronics manufacturers and suppliers. He has more than 20 years of experience in international trade, technology, and supply chain policy.

 

 

Powering U.S. Electronics Talent with Apprenticeship

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The talent gap in U.S. electronics manufacturing continues to widen, making hiring and training major supply chain constraints.

Hiring is now a strategic supply chain issue—requiring stronger pipelines, more effective training, and closer collaboration with education and workforce partners.

This executive webinar brings together leaders from government and industry to share practical strategies for using apprenticeship to address workforce challenges and build a more resilient talent pipeline.

Featured Speakers

  • Dr. Nakeya Womack, U.S. Department of Labor 
  • Lea Tavani, VP of HR, Mack Technologies 
  • Victoria Hawkins, Director Workforce Funding and Partnerships, Global Electronics Association

What You’ll Learn

  • How to strengthen your talent pipeline for 2026 and beyond 
  • Available funding opportunities and apprenticeship programs 
  • Proven approaches to upskilling, training, and retention 
  • Insights on policy and industry collaboration 
Region

Standardized Connectivity Drives Smart Manufacturing Upgrade

Phoenix Contact DIP Line Recognized as IPC HERMES Demo Line

IPC China has officially designated the “IPC HERMES Demo Line” as an DIP production line of Phoenix Contact Asia-Pacific  (Nanjing) Co., Ltd. during a ceremony held on April 21.

The recognition affirms the line’s full implementation of the IPC-HERMES-9852 standard and highlights a leading industry example of leveraging international standards to enable connectivity and intelligent transformation in electronics manufacturing.

Advancing Interoperability Through Open Standards

On the day of the ceremony, Sydney Xiao, President of East Asia at the Global Electronics Association, led a delegation of standards and technical team on a site visit and exchange. The delegation met with Lei Chen, Senior Vice President of Phoenix Contact China; Qing Ye, Director of the Power Reliability regional business unit and Industrial Electronics Operations; and members of Phoenix Contact’s management, engineering, and digitalization teams. Both sides exchanged views on demo line implementation, production line achievements, and future collaboration opportunities.

From Technical Challenge to Scalable Application

The IPC-HERMES-9852 standard addresses board-level data exchange and communication between manufacturing equipment.

The awarded DIP automatic line was jointly developed by Phoenix Contact and multiple equipment suppliers. During implementation, the project team adressed key technical challenges, particularly the integration of PLC systems with the HERMES protocol. By leveraging the PLCnext platform, Phoenix Contact achieved deep integration between communication protocols and control systems. 

Through standardized HERMES standard, the line now enables:

  • Automated program downloading 
  • Multi-product changeover 
  • Mixed-model production

These applications demonstrate the practical value of open communication standards in electronics assembly environments.

Quantifiable Results: Cost, Efficiency, and Flexibility

According to the project team, the implementation has delivered measurable benefits:

  • Cost optimization: Reduced the need for 15–17 barcode scanners per line, lowering hardware investment
  • Efficiency gains: Changeover time reduced by over 60%, with overall equipment effectiveness (OEE) improved by more than 10%
  • Enhanced flexibility: Plug-and-play equipment integration shortened system integration cycles by 50%, while enabling seamless interoperability with IPC-CFX-2591

Industry Validation and Strategic Outlook

Lei Chen noted that the recognition validates both the production line achievements and the broader importance of standardization in building a collaborative industrial ecosystem.

“As the industry faces challenges such as fragmented systems and inconsistent standards, establishing open, collaborative, and scalable standard frameworks is becoming essential. Phoenix Contact will continue to accelerate innovation based on unified standards and quality systems, while strengthening ecosystem collaboration to build a more resilient industrial landscape.”

Sydney Xiao also praised the project: “The Phoenix Contact Nanjing Demo Line is an excellent example of how manufacturers can apply international standards to break down data silos and enable equipment interoperability. Its successful implementation provides a scalable model for the industry, demonstrating that open standards are a critical pathway to improving efficiency, enabling flexible manufacturing, and advancing smart transformation.”

Scaling Standard Adoption Across the Industry

Looking ahead, IPC China will continue working with ecosystem partners across the value chain to accelerate the adoption of IPC standards in real manufacturing environments, supporting the intelligent upgrade of the electronics manufacturing industry.

 

PCB Design for Advanced Design Concepts

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Design high-density, complex PCB systems that meet performance requirements even as space, geometry, and packaging constraints increase.

Develop the ability to compress layouts, work with advanced materials, and implement non-standard placement, routing, and board geometries. Apply techniques for HDI, embedded components, cavities, and printed electronics so your designs remain reliable, manufacturable, and aligned with modern product demands.

This course is ideal for designers, engineers, technicians, and other individuals who want to acquire or increase their ability to meet the design, manufacturing, packaging, and routing challenges posed by smaller and smaller boards

 

 

PCB Design for Military & Aerospace and Other Extreme Applications

Date
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Class meets Monday, Wednesday

Develop the ability to make layout, stackup, material, and packaging decisions for military, aerospace, and space applications. Apply techniques that account for vibration, shock, thermal extremes, mechanical retention, radiation effects, and IPC requirements so your designs are built to perform where failure is not an option.

This course is ideal for designers, engineers, technicians, and other individuals who want to acquire or increase their ability to meet the design, manufacturing, packaging, and routing challenges posed by military, aerospace, and space applications.

IPC strongly recommends that students either complete the IPC Introduction to PCB Design I & II courses or possess a solid foundation in electrical theory, be able to use PCB design software, and have familiarity with:

  • Schematic symbol creation 
  • Schematic generation 
  • Documentation and dimensioning 
  • Standard rigid printed board design 
  • Printed board manufacturing 
  • Printed board assembly 
  • Basics of signal integrity