Winners of Hand Soldering and Wire Harness Competitions Announced at NEPCON Vietnam 2025

In conjunction with NEPCON Vietnam 2025, the Global Electronics Association hosted its popular Hand Soldering Competition on September 11–12, 2025, and the Northen regional round of the Wire Harness Competition on September 10, 2025, in Hanoi, Vietnam.

This year’s Hand Soldering Competition featured 38 contestants from 15 companies, representing both leading foreign direct investment (FDI) manufacturers and local Vietnamese enterprises. Notably, for the first time in the competition’s history, a contestant from a small domestic enterprise claimed the top prize. Skilled contestants were challenged to build a functional electronics assembly within a limited time, judged on soldering quality in accordance with IPC-A-610J Class 3 criteria, production speed, and overall electrical functionality.

Winners of the Hand Soldering Competition:

  • First Place: Phạm Văn Tuyền, EZ2DO Company Limited – Achievement Certificate, USD $300, and an Intelligent Portable Soldering Iron from Platinum sponsor QUICK. He also qualified for the IPC Hand Soldering World Championship in Munich, Germany, November 2025.

  • Second Place: Lê Thị Thu, Spartronics Vietnam Co., Ltd. – Achievement Certificate and USD $200.

  • Third Place: Lê Đức Nhã, UMC Electronics Vietnam Limited – Achievement Certificate and USD $100.

The Wire Harness Competition Vietnam drew 27 participants from 13 companies, demonstrating proficiency in wire harness assembly under IPC/WHMA-A-620 Class 3 standards, the highest benchmark of workmanship in the electronics industry. Contestants were tasked with building a functional harness assembly within a set timeframe, judged on both process quality and final workmanship.

Winners of the Wire Harness Competition:

  • South Regional Winner: Nguyen Minh Thuan, Thermtrol (VSIP) Co., Ltd.

  • North Regional Winner: Pham Van Thao, Vietkai Company Limited

The overall Vietnam Champion title was awarded to the Northern Region winner, Mr. Pham Van Thao from Vietkai Company Limited. He completed the assembly in five minutes less than the Southern Region winner, with the same score. He received a trophy and Achievement Certificate and earned the opportunity to represent Vietnam at the Wire Harness World Championship during the Integrated Electronics Manufacturing & Interconnection (IEMI) event in Bengaluru, India, January 29–30, 2026.

This year’s competitions were made possible through the generous support of sponsors:

  • Platinum Sponsor QUICK INTELLIGENT EQUIPMENT

  • Gold Sponsors NIHON SUPERIOR and SOLDERINDO

These competitions continue to highlight Vietnam’s growing electronics manufacturing talent and provide a platform for local and international companies to showcase excellence in workforce skills and industry collaboration.

Global Electronics Association Strengthens Role as Industry Convener, Announces Upcoming Events to Advance Innovation and Collaboration

The Global Electronics Association launches a series of flagship events to convene leaders of a $6T industry as they navigate new technologies, AI implementation, supply chain resiliency and more. The Association's upcoming conferences and tradeshows connect leaders, engineers, and technologists with the solutions and insights they need most.

“From design to assembly to recycling, no single company or industry sector can achieve progress in isolation,” said John W. Mitchell, Global Electronics Association president and CEO. “Our Association provides the forums where critical conversations happen, connections are made, and the future of the industry is shaped.”

The Association’s upcoming events include:

  • IPC CEMAC – September 25-26, Shanghai – This year’s conference, themed “Shaping a Sustainable Future,” will address critical advancements in AI-enabled digital transformation, next-generation packaging technologies, PCB/PCBA process innovations, and ESG-driven sustainability practices. The program is designed to strengthen cross-border collaboration and accelerate technology development that underpins the long-term resilience and sustainable growth of the global electronics industry.
  • Pan-European Electronics Design Conference (PEDC) – January 21-22, 2026, Prague, Czech Republic – Co-organized with Fachverband Elektronikdesign und -fertigung e. V. (FED), the technical conference addresses the industry’s pressing design challenges. Featuring peer-reviewed presentations, attendees gain access to cutting-edge research on silicon-to-systems integration, proven Design for Excellence (DfX) methodologies, and sustainable design frameworks that meet new EU regulations. The conference is limited to 400 participants to ensure meaningful networking and direct access to presenting experts.
  • Integrated Electronics Manufacturing & Interconnections (IEMI) – January 29-30, 2026, Bengaluru, India – India’s premier electronics event features the World Wire Harness Competition, vendor development workshops, one-to-one business matchmaking, educational sessions, and a product showcase.  
  • APEX EXPO – March 14-19, 2026 – Anaheim, Calif. – North America’s largest electronics industry gathering expects more than 400 exhibitors and 7,000 attendees. OEMs, EMS providers, PCB manufacturers and industry professionals from around the globe come together to access the latest technical content, contribute to standards development, and take part in exclusive product and service launches and the Design Village, where next-generation advanced electronic packaging and system co-design come to life. Pre-conference professional development workshops on March 15-16 offer technical training and the Learning Lounge with workforce training and certification tracks takes place, March 17-19.
  • EWPTE (Electrical Wire Processing Technology Expo) – May 5-7, Milwaukee, Wisc. – The leading event for wire harness, cable, and connector technologies, delivering hands-on technical training and access to top-tier suppliers and innovations.

Added Mitchell, “In an industry where technological advances and supply chain resilience are crucial to success, these events provide the connections, partnerships, and knowledge that drive measurable business results and help address shared challenges.  

Register now at electronics.org/events or contact events@electronics.org for group discounts. Follow @GlobalElectronicsAssociation on LinkedIn for real-time updates and speaker announcements.

New England EMS Leadership Roundtable: Bot or Not? AI, Automation, and Assembling the Workforce of the Future

Date
- (3:00 - 7:00pm CDT)

Wednesday, October 15, 2025 | 4:00 pm – 8:00 pm
Location:

Seasons 52
6 Wayside Rd
Burlington, MA 01803
781-272-5552

Join fellow EMS leaders in the region to share industry pain points and solutions. Participants steer the conversation—resulting in unique takeaways that reflect the priorities in the room.

To start the conversation, we will discuss AI. AI is taking over manufacturing—but who’s teaching the humans? In this lively roundtable, EMS executives will unpack how AI is reshaping production, quality control, and (ironically) the jobs we need to fill. Join us as we decode the best strategies for recruiting and training a workforce that won’t short-circuit in the face of automation. The future is here, and it still needs operators (for now).

Following this presentation, participants will discuss the technologies and impacts of AI and automation on their business and workforce. Discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. No two roundtables end the same.

Complimentary registration includes: 
•    Peer-led roundtable discussions
•    Updates on relevant EMS industry studies/reports
•    Recap of business resources available
•    Reception and dinner
•    Peer networking, partnership building

Questions? MarkWolfe@electronics.org 

Book your spot for an executive level solution roundtable! Space is limited.

Seasons 52

6 Wayside Rd
Burlington, MA 01803
United States

Seasons 52

Seasons 52
6 Wayside Rd
Burlington, MA 01803
United States

Modern Wire Bonding in Package Assembly

Date
-

Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenges, and emerging materials. Learn about pitch shrinkage demands, direct bonding to Cu on ULK substrates, and innovations like silver and gold-coated palladium copper wires. Explore key bonding techniques including thermosonic, ultrasonic, and thermocompression, plus new options for Cu wire coatings.

Perfect for engineers navigating next-gen packaging and reliability.

 

Tom Dory October 22, 2025

Speaker Bio:

Dr. Dory has extensive experience in microelectronics covering semiconductor fab processing and assembly, hybrid circuits, and package assembly & test. He has worked in many different aspects of semiconductor manufacturing, including plasma deposition, RTP, and packaging technologies, while at Intel Corporation. Dr. Dory retired from Intel in the Assembly and Test Technology Development Research division after 20 years in R&D. As Pathfinding Integration Manager of the Intel Substrate Technology Research Labs, he was responsible for the development of advanced packaging technology in the areas of MEMS, wafer-level bonding, stacked die packages, and line pitch reduction designs. He specialized in packaging and assembly, focusing on high-density substrate manufacturing and chip assembly, including wire bonding, flip chip, and 3D packaging.

Dr. Dory was a lecturer on the Arizona State University chemical engineering faculty, teaching semiconductor processing and all transport phenomena. He is the author or co-author of over 35 patents and publications in the areas of semiconductor chemicals and package design, including underfill applications and embedded package capacitors. He is a member of the Electrochemical Society and a Senior Member of IEEE. 

 

 

 


 

Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics

Date
-

Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics - A Non-Technical Guide to Component Authentication

Join SAE G19A subcommittee expert Anthony Bryant for an essential one-hour webinar focused on supply chain integrity and counterfeit electronics prevention. This session is specifically designed for non-technical personnel working in the electronics component supply chain including procurement professionals, supply chain managers, quality assurance staff, and business leaders.

With counterfeit electronics reporting increasing by 25% in 2024 to over 1,055 suspect parts, the threat to supply chain integrity has never been more critical. This webinar will equip attendees with practical knowledge to identify red flags, understand current trends, and implement effective counterfeit mitigation strategies that protect both business operations and end-user safety.

Key Learning Outcomes:
• Understand current counterfeit electronics trends and their business impact
• Learn visual inspection techniques requiring no technical background
• Identify documentation red flags and fraudulent paperwork
• Recognize supplier risk indicators and sourcing vulnerabilities
• Implement practical counterfeit avoidance strategies
• Understand regulatory compliance requirements and industry standards

Target Audience: Procurement professionals, supply chain managers, quality assurance personnel, business leaders, and anyone involved in electronics component sourcing and management.

 

Anthony Bryant September 24

 Speaker Bio:

Anthony J. Bryant is a trained expert in component counterfeiting detection techniques. He has collaborated with The Global Electronics Association on intermediate-level courses and webinars related to counterfeit electronics detection. With over 35 years of experience in the electronics manufacturing industry, Bryant witnessed the pervasive issue of substandard and counterfeit electronic components.

His journey began in the U.S. Navy, where he served as a fire control missiles technician (FCM). This firsthand experience highlighted the critical importance of reliable electronics in mission-critical applications, and he saw the consequences of equipment failures.
Transitioning to the civilian sector, Bryant pursued a career in aerospace and defense contract manufacturing. His commitment to quality led him to seek advanced training at leading electronics institutions, including ACI Technologies Inc. (formerly known as the American Competitiveness Institute) in Philadelphia.

During the COVID-19 pandemic, the problem of counterfeiting escalated significantly. Bryant personally encountered 19-20 instances where parts previously identified, rejected, and confiscated by the government resurfaced in the supply chain. This recurring cycle of non-conforming materials poses a persistent threat to the electronics supply chain.

His dedication to safety and national security stems from his service in the U.S. military, where he witnessed the catastrophic consequences of substandard equipment. Bryant’s expertise contributes to addressing the challenges posed by counterfeit electronic parts in high-reliability organizations. 
 

 

 


 

WHMA's Annual Global Leadership Summit

Date
-

The wire harness industry is constantly evolving with new technology and practices. The 2026 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this fast-changing landscape. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs and suppliers for companies that build wiring harnesses and cable assemblies.

  • Peer-to-peer networking provides countless opportunities for you to improve your business as you learn, share, and discover new approaches to the wire harness industry.
  • Learn from industry leaders at best-practices roundtables, technical education workshops, and keynote speakers.
  • Get the first look at cutting-edge technology in the Exhibit Hall featuring industry leading suppliers.
JW Marriott Las Vegas the Resort & Spa

221 North Rampart Boulevard
Las Vegas, NV 89145
United States

JW Marriott Las Vegas the Resort & Spa

JW Marriott Las Vegas the Resort & Spa
221 North Rampart Boulevard
Las Vegas, NV 89145
United States