New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability

IPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance. IPC-8981 introduces a common framework for evaluating wearables that integrate electronics directly into textile materials—applications that span healthcare, defense, fitness, and consumer technology.

 

The standard was developed by the IPC E-Textiles Wearables Standard Task Group, led by Vladan Koncar of ENSAIT GEMTEX Lab – University of Lille and Sigrid Rotzler of Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration. The task group included international experts from both the textile and electronics industries, bringing multidisciplinary insight to the testing needs of e-textile wearables.

 

“As the first standard of this kind, IPC-8981 provides a solid basis for e-textile developers to make their products more reliable, set quality targets, and choose relevant testing methods,” Rotzler explained.

 

Added Koncar, “Our IPC-8981 standard and the associated test methods are essential: They help companies from both the textile and electronics sectors collaborate more effectively to develop high-quality products that are ready for market adoption.”

 

IPC-8981 is supported by 14 newly published IPC-TM-650 Test Methods covering environmental and mechanical durability factors such as abrasion, perspiration, UV exposure, and washing. It also offers guidance on part classification, testing thresholds, and how to reduce unnecessary testing steps to streamline development.

 

The release of IPC-8981 marks a pivotal step forward for the e-textiles wearables industry—providing the tools needed to transform wearable electronics from promising prototypes into reliable, market-ready solutions.

 

To purchase IPC-8981, visit the IPC Store. To learn more or join the IPC E-Textiles Wearables Standard Task Group and guide future enhancements to the standard, visit IPC’s committee page.

North American EMS Industry Up 0.2 Percent in March

IPC releases EMS industry results for March

IPC announced today the March 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.37.

Total North American EMS shipments in March 2025 were up 0.2 percent compared to the same month last year. Compared to the preceding month, March shipments were up 4.2 percent. March’s year-to-date (YTD) shipments decreased by 0.3% year-over-year (YOY).

EMS bookings in March increased 12.7 percent year-over-year and increased 10.5 percent from the previous month. March’s YTD bookings increased 4.0% compared to the same period last year.

“March bookings jumped as buyers raced to get ahead of mounting uncertainty. Concerns over geopolitical tensions and potential tariff hikes have prompted preemptive orders as firms look to secure inventory before conditions worsen,” said Shawn DuBravac, IPC’s chief economist. “But while bookings surged, shipment growth remained relatively flat, reminding us that order volumes have a natural ceiling dictated by production capacity limitations.”

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

 

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

North American PCB Industry Shipments Down 3.1 Percent in March

IPC Releases PCB Industry Results for March 2025

IPC announced today the March 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.

Total North American PCB shipments in March 2025were down 3.1 percent compared to the same month last year. Compared to the preceding month, March shipments were down 2.3 percent. March's year-to-date (YTD) shipments increased by 8.7% year-over-year (YOY).

PCB bookings in March were down 0.3 percent compared to the same month last year. March bookings were down 31.8 percent compared to the preceding month. March’s YTD bookings increased 19.3% compared to the same period last year.

“March marked the closest alignment between bookings and shipments that we’ve seen since October 2024—a signal that supply chains may be stabilizing, even as demand remains firm,” said Shawn DuBravac, IPC’s chief economist. 

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

 

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

 

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

IPC Strengthens Global Leadership Team with Addition of Joe Schneider as Vice President of U.S/Canada

IPC announces the strategic appointment of Joe Schneider as vice president of U.S./Canada. This newly created executive position underscores the association’s commitment to championing the electronics industry's critical contributions to this region’s innovation and economic growth. 

 

In this role, Schneider is responsible for ensuring that the needs of this vital region’s electronics industry are clearly understood and served by IPC and accomplished by developing strong relationships with regional membership, customers, and partners along with providing exceptional service delivery and identifying new business opportunities throughout the electronics eco-system.

 

With an impressive resume, Schneider brings more than two decades of executive experience with very successful roles and increasing responsibility in the EMS industry (Flex, Sparton) and the medical devices industry (Abbott, Siemens Healthcare). Immediately prior to joining IPC, he served as the vice president of commercial operations, health solutions for Flex in Buffalo Grove, Ill. While there, he led multi-site operations responsible for medical device, equipment and drug delivery for the healthcare industry.

 

“As our members, partners and other industry stakeholders meet Joe and see him in action, it will become very apparent that developing strong relationships with our targeted community and finding creative ways to address their challenges are part of his natural DNA. We look forward to him implementing the right strategies to better know the industry and in parallel fulfill our mission to serve the membership,” said Sanjay Huprikar, IPC’s chief global officer. 

           

IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data

IPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing. 

 

Version 2.0 provides substantial updates or expansions to support a broader range of shop floor operations. This includes capabilities added for hand soldering and wave soldering operations – expanding the total number of supported device types to 14 – and providing a pathway for gateway solutions providers to demonstrate their CFX capabilities via the CFX Validation and Qualification System. 

 

Additionally, CFX version 2.0 includes new capabilities, message additions, and structural changes to support smarter factory operations, including, for example:

 

  • New messaging to support Automated Guided Vehicle (AGV) and Autonomous Mobile Robot (AMR) technologies deployed in a CFX environment
  • Message field added to enable traceability of specific PCB differences (e.g., board vendor identification), which can be used to influence inspection outcomes and process optimization

  • SMT placement capabilities extended to include pick-and-place cycle information for each component to provide a detailed view of component placement and any failed pickup attempts on the machine and capture how many consecutive pickup attempts occurred before a placement error 

  • Improved handling of dynamic recipe changes during production by logging any on-the-fly modifications an operator makes to an active recipe at the equipment level

     

As with all previous IPC-2591 CFX releases, the CFX version 2.0 software development kit (SDK) is backward compatible with previous versions of the CFX SDK.

 

“Each of these enhancements in IPC-CFX 2.0 was driven by real-world manufacturing needs and vetted by the IPC task group to maintain compatibility with earlier versions,” said Thomas Marktscheffel, director of product management software solutions at ASMPT. “The result is a more expansive and detailed standard that covers a broader array of production processes and delivers richer data from machines, enabling smarter analytics and more efficient operations across the connected factory.”

 

To purchase IPC-2591, Version 2.0, visit the IPC Store. For more information on CFX, including access to the latest SDK and software development resources, visit www.ipc-cfx.org

Wiring the World Together: IPC and WHMA Unveil Global Wire Harness Competitions and Championship

IPC, in collaboration with the Wiring Harness Manufacturer's Association (WHMA), has organized the first-ever World Wire Harness Competitions and Championship. Regional country competitions will take place between March and December 2025 and final championship will be held at IPC’s Integrated Electronics Manufacturing & Interconnections (IEMI) event scheduled January 29–30, 2026, in Bangalore, India. The global initiative promotes industry’s best practices and strengthens the skilled workforce behind cable and wire harness assembly.           

 

Country wire harness competitions will take place in China (March 27-28), Sri Lanka (April 4), Australia (May 7), UAE (May 8), Vietnam (May 16 and September 10-12), Malaysia (July 23-25), Saudi Arabia (July), Thailand (August 20-22), Mexico (August), Philippines (October), and Egypt (November).                                                     

 

The global competition will bring together top talent from across the world to compete, collaborate, and showcase the highest standards of craftsmanship in wire harness assembly—an essential function in modern electronics manufacturing.

 

The competition will follow IPC/WHMA-A-620 Revision E, the industry benchmark for quality and reliability in the cable and wire harness industry. Participants will be evaluated on a wide range of competencies, including wire preparation, crimping, soldering, BOM verification, and final assembly workmanship. 

 

The World Wire Harness Competitions and Championship come at a time when the global wire harness market is poised for substantial growth. With a projected compound annual growth rate (CAGR) of 7.2 percent between 2024 and 2034, the sector is expanding across automotive, aerospace, defense, and industrial applications. 

 

“The wire harness competitions and subsequent championship are a global celebration of craftsmanship, collaboration, and excellence—bringing the best of each region together to inspire and celebrate the beauty inside of our craft and the people,” said Parker Garrett, EMSCO, chairman, WHMA.

 

Positioned as a centerpiece of IEMI 2026, the championship is expected to attract worldwide attention from leading manufacturers, industry stakeholders, and innovation-driven enterprises. For more information on regional rounds, sponsorship opportunities, or participation guidelines, visit: www.ipc.org/ipc-india-Wireharness-2025.