North American PCB Demand Strengthens as July Bookings Surge 62%

The Global Electronics Association releases PCB industry results for July 2026

The Global Electronics Association announced today the July 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.46.

Total North American PCB shipments in July 2026were up 14.5% compared to the same month last year. Compared to the preceding month, July shipments were up 19.8%. July’s year-to-date (YTD) shipments increased by 13.0% year-over-year (YOY).

PCB bookings in July were up 62.0% compared to the same month last year. July bookings were up 28.1% compared to the preceding month. July’s YTD bookings increased 33.3% compared to the same period last year.

“PCB activity accelerated meaningfully in July, with strong gains in both shipments and new orders. July extends what has become a sustained period of growth for the North American PCB industry,” said Dr. Shawn DuBravac, the Global Electronics Association’s chief economist. 

3-Month Book-to-Bill

1-Month Book-to-Bill

Shipments 3-Month MA

Bookings

3-Month MA

Shipments YTD

Bookings YTD

1.46

1.39

2.5%

0.05%

13.0%

33.3%

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. The Association publishes the PCB book-to-bill ratio by the end of each month.

California EMS Leadership Roundtable

Date
- (6:00 - 10:00pm CDT)

California EMS Leadership Roundtable
Connected or Complicated? Digital, Automation, and the Future of Supply Chain Resilience
Thursday, October 8, 2026 | 4:00 pm–8:00 pm
Maggiano’s Little Italy – Santana Row
3055 Olin Ave., Suite 1000
San Jose, CA 95128

Hosted by the Global Electronics Association in partnership with DigiKey

Complimentary Registration | Reception and Dinner Included

Common Challenges. Candid Conversations. Practical Ideas.

Join EMS executives and senior leaders from across California and beyond for candid peer discussion, relevant industry insight, and practical ideas.

This year’s conversation will center on a fundamental question: Are digital tools and automation making the electronics supply chain more connected and resilient—or simply more complicated? We will explore where stronger connections among customers, EMS companies, distributors, and suppliers can create meaningful value, and where additional technologies, systems, and automation may introduce more complexity than benefit. At the center of the discussion will be enabling the next generation of digital business by connecting customers more effectively with their manufacturing, distribution, and supply partners.

The informal reception and dinner will give participants an opportunity to build relationships, compare perspectives, and candidly discuss the issues they are confronting across their businesses. Global Electronics Association membership is not required, and companies are welcome to register more than one senior leader.

We will begin by sharing unique EMS industry demographics, financial data, and market information relevant to EMS leaders. Leaders from DigiKey will also contribute perspectives on emerging supply chain challenges and our broader conversation theme, sharing what they are seeing across customers, suppliers, distribution partners, and the broader electronics ecosystem as digital capabilities, automation, and supply-chain models continue to evolve.

As always, the announced theme is only the starting point. Previous roundtables have expanded into workforce strategy, customer acquisition, growth, tariffs, margins, technology investment, benchmarking, equipment, supply chain, and overall business conditions. Participants determine where the conversation goes—which is why no two roundtables end the same.

The clearest indication of the value participants find in these sessions is repeat participation: many companies return, and several bring multiple members of their leadership teams. Because the roundtable works best as a small, highly interactive group, attendance will be limited.

Any questions? Contact Mark Wolfe

Maggiano’s Little Italy – Santana Row

3055 Olin Ave., Suite 1000
San Jose, CA 95128
United States

Maggiano’s Little Italy – Santana Row

Maggiano’s Little Italy – Santana Row
3055 Olin Ave., Suite 1000
San Jose, CA 95128
United States

North American EMS Orders Surge in July as Book-to-Bill Stands at 1.29

The Global Electronics Association releases EMS industry results for July 2026

The Global Electronics Association announced today the July 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.

Total North American EMS shipments in July 2026 were down 0.3% compared o the same month last year. Compared to the preceding month, July shipments were down 5.8%. July’s year-to-date (YTD) shipments increased by 6.2% year-over-year (YOY).

EMS bookings in July increased 44.3% year-over-year and increased 76.0% from the previous month. July’s YTD bookings increased by 11.0% compared to the same period last year.

“EMS momentum continued in July, with order activity accelerating sharply while shipments struggled to keep pace,” said Dr. Shawn DuBravac, the Global Electronics Association’s chief economist. 

EMS book to bill ratio, July 2026

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. The Association publishes the EMS book-to-bill ratio by the end of each month.

 

Winners of Hand Soldering Competition Vietnam 2026 Announced

The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.

This year’s competition attracted 91 contestants from 28 companies and five educational organizations, representing both leading foreign direct investment (FDI) manufacturers and local Vietnamese enterprises. Contestants were challenged to complete an electronic assembly within a limited time and were evaluated based on soldering quality in accordance with IPC-A-610J and IPC-J-STD-001J Class 3 criteria, as well as production speed and the overall quality of assembly completion and soldering workmanship.

Southern Regional Round Winners:

  • First Place: Trần Thanh Vinh, CEI International Investments (VN) Limited – 249 points.
  • Second Place: Nguyễn Văn Nhí, Spartronics Vietnam Co., Ltd. – 242 points.

Northern Regional Round Winners:

  • First Place: Ngô Văn Tú, UMC Electronics Viet Nam Co., Ltd – 241 points.
  • Second Place: Lê Thu Hương, Sato Vietnam Co ., Ltd. – 238 points.

Vietnam Champion:

The title of Vietnam Champion was awarded to Trần Thanh Vinh of CEI International Investments (VN) Limited, the winner of the Southern Regional Round. With a score of 249 points, he finished eight points ahead of the Northern Regional winner.

As Vietnam Champion, Vinh will represent Vietnam at the Hand Soldering World Championship in Munich, Germany, in November 2026.

The 2026 Hand Soldering Competition Vietnam was made possible through the generous support of the following sponsors:

  • Platinum Sponsor: QUICK INTELLIGENT EQUIPMENT
  • Gold Sponsors: NIHON SUPERIOR and SOLDERINDO
  • Supporting Sponsor: LORIOT

The Hand Soldering Competition continues to highlight Vietnam’s growing electronics manufacturing talent while providing a platform for companies, skilled professionals, and educational organizations to demonstrate excellence in electronics manufacturing skills and strengthen industry collaboration.

The Global Electronics Association congratulates all contestants and winners for their outstanding performance and thanks the sponsors, participating companies, educational organizations, and industry partners for their support in making the 2026 competition a success.

Global Electronics Association Brings IPC Builds Standards Development Event to Paris

Industry experts will advance electronics standards for traceability, sustainability data, connected factories, high-speed electronics and next-generation manufacturing

The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built, tested and trusted worldwide.

The Global Electronics Association will host IPC Builds, Sept. 19–24, 2026, bringing together engineers, manufacturers, suppliers, technical experts and standards leaders for a week of standards development committee meetings focused on the future of electronics manufacturing.

Committee meetings will cover foundational IPC standards used throughout the global supply chain as well as emerging areas such as digital traceability, Connected Factory Exchange, supplier declaration data flows, CO₂e reporting, high-speed/high-frequency materials, printed electronics, additive manufacturing and advanced reliability.

Why it matters 

IPC standards are used globally by electronics manufacturers and suppliers to establish common expectations for quality, reliability, acceptability, materials, processes and performance. At IPC Builds, industry professionals do the technical work of updating existing standards and developing new frameworks to keep pace with changing technologies, market needs and regulatory pressures.

“Electronics manufacturers are facing new expectations around sustainability, data exchange, traceability, quality and reliability,” said Matt Kelly, chief technology officer and vice president of standards and technology solutions, Global Electronics Association. “IPC Builds gives the people closest to these challenges a direct role in shaping the standards the industry depends on.”

The Paris event comes as European manufacturers and suppliers navigate increasing requirements related to product carbon footprint, digital product passports, supply chain transparency, advanced manufacturing and interoperability across connected production environments.

Committee meetings will address topics across the full electronics manufacturing lifecycle, including:

  • Product assurance: printed boards, assemblies and wire harnesses.
  • Assembly and joining: solderability, solder alloys, bottom termination components and system-in-package technologies.
  • Base materials: laminates, metallic foils and metal-based substrates.
  • Rigid and flexible printed boards: design, fabrication and reliability.
  • Cleaning and coating: conformal coating, flux residues, CAF, potting and encapsulation.
  • Printed electronics: 3D plastronics and additively manufactured electronics.
  • Electronic data and traceability: design data transfer, Connected Factory Exchange, Hermes, materials and process traceability, supplier declaration data flows and CO₂e reporting.
  • High-speed/high-frequency electronics: RF/microwave performance and high-speed base materials.
  • Process control and reliability: automated inspection process control, SMT attachment reliability, inspection and microsection analysis.

The event also provides an entry point for companies that want to better understand how standards are developed and how participation can help them anticipate technical, customer and regulatory requirements.

IPC Builds will take place Sept. 19–24, 2026, in Paris, France. Registration is open at https://www.electronics.org/event/ipc-builds-standards-development-committee-meetings. There is no cost to attend.

Global Electronics Association Strengthens Taiwan Technical Leadership in Advanced Electronic Packaging

Jeffrey ChangBing Lee Appointed as Taiwan Lead Expert for Advanced Electronic Packaging

As advanced electronic packaging becomes increasingly important to enabling next-generation semiconductor innovation, including chiplet architectures, 3D integration, and advanced substrate technologies, the Global Electronics Association today announced the appointment of Jeffrey ChangBing Lee as Technology Solutions Lead Expert for Advanced Electronic Packaging (AEP) – Taiwan.

As advanced electronic packaging becomes increasingly important to next-generation semiconductor and system innovation, the industry is shifting from isolated technology development toward closer collaboration across the supply chain. This shift reflects the growing role of advanced packaging in system-level integration, where progress increasingly depends on expertise spanning multiple parts of the electronics value chain. Taiwan remains a key center of innovation in this area, making technical engagement and industry collaboration increasingly important to the future development of advanced electronic packaging technologies.

In this role, Lee will support Technology Solutions   in Taiwan by fostering technical collaboration across the electronics ecosystem, contributing to standards/guidelines development and technology roadmapping efforts, and engaging with industry, academia, and research organizations to address emerging challenges in advanced electronic packaging.

“Taiwan plays a pivotal role in the global electronics supply chain and continues to lead innovation in advanced electronic packaging technologies,” said Matt Kelly, CTO & VP Technology Solutions of the Global Electronics Association. “As advanced packaging becomes an increasingly important driver of semiconductor and system innovation, competitive advantage will depend not only on technology leadership, but also on how effectively expertise is shared across the broader ecosystem. Taiwan’s depth of knowledge and strong industry participation position it to help shape the next generation of packaging technologies. Jeffrey’s extensive technical expertise, industry leadership, and long-standing involvement in global standards development will help strengthen connections with Taiwan’s technical community and support Technology Solutions in the region.”

Lee brings more than 30 years of experience in semiconductor packaging, PCB assembly, materials engineering, quality and reliability, and technology development. He has been an active contributor to many international industry organizations, including IPC, JEDEC, SEMI, SMTA, IMAPS, IEEE Electronics Packaging Society (EPS), TPCA, and iNEMI.

This appointment reflects the Global Electronics Association’s continued commitment to strengthening engagement with Taiwan’s advanced electronic packaging community. By expanding its technical presence in the region, the Association aims to strengthen connections between Taiwan’s expertise and its global technology initiatives, helping ensure that insights from one of the world’s leading advanced packaging ecosystems contribute to the future development of the global electronics industry.