Research on the Laminating Technology of Embedded Optical Fiber Array PCB

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Optical fiber array can realize multi-channel optical signal transmission. In the process of embedded PCB, the difficulty lies in laminating. The structure of the optical fiber array determines the need to design corresponding laminated structures and laminating parameters to ensure the integrity and reliability of the embedded optical fiber array. In this paper, the special laminated structure design, slotting design, and processing flow parameter settings are used to achieve the complete embedding of optical fiber array in PCB, and ensure that the product has good thermal reliability.

Author(s)
Junquan Wu, Hongde Lin
Resource Type
Technical Paper
Event
IPC APEX EXPO 2024

Development of Ring Ferrite Embedded PCB with High Precision Inductance

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Embedding the magnetic core into the PCB can reduce the occupation of PCB area by some inductive devices, but there is often a risk of magnetic core fragmentation and PCB delamination. This article proposes a highly reliable magnetic core embedding solution, and through precise calculation and circuit design, a ±10% inductance accuracy ring ferrite embedding PCB fabrication has been achieved. In addition, a simple measuring method for inductance saturation current has been proposed, enriching the characterization of key parameters of ring ferrite embedding PCB.

Author(s)
Junquan Wu
Resource Type
Technical Paper
Event
IPC APEX EXPO 2024

Sustainable Smart Surfaces

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The scope of this paper is sustainability of in-mold electronics. This technology has many benefits, such as decreasing material usage, using additive manufacturing processes and simplifying supply chain. Results from an automotive life cycle assessment quantify the impact of these benefits. This paper presents recycling and other activities for further improving sustainability. It also outlines two major initiatives targeting a circular economy: EU’s Circular Economy Action Plan and the World Economic Forum’s Circular Cars Initiative.

Author(s)
Outi Rusanen, Pälvi Apilo, Janne Jääskä, Katriina Otsamo, Sampo Pirilä and Topi Wuori
Resource Type
Technical Paper
Event
IPC APEX EXPO 2024

Texas/Dallas Area EMS Leadership Roundtable: Bot or Not? AI, Automation, and Assembling the Workforce of the Future

Date
-

August 13, 2025 | 4:00 pm – 8:00 pm 
Location:
Aboca's on 75 and Arapaho 
100 Central Expy, Suite 63
Richardson, TX 75080

Join fellow EMS leaders in the region to share industry pain points and solutions. Participants steer the conversation—resulting in unique takeaways that reflect the priorities in the room.

To start the conversation, we will discuss AI. AI is taking over manufacturing—but who’s teaching the humans? In this lively roundtable, EMS executives will unpack how AI is reshaping production, quality control, and (ironically) the jobs we need to fill. Join us as we decode the best strategies for recruiting and training a workforce that won’t short-circuit in the face of automation. The future is here, and it still needs operators (for now).

Following this presentation, participants will discuss the technologies and impacts of AI and automation on their business and workforce. Discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. No two roundtables end the same.

Complimentary registration includes: 
•    Peer-led roundtable discussions
•    Updates on relevant EMS industry studies/reports
•    Recap of business resources available
•    Reception and dinner
•    Peer networking, partnership building

Questions? MarkWolfe@electronics.org 

Book your spot for an executive level solution roundtable! Space is limited.

Aboca's on 75 and Arapaho

100 Central Expy, Suite 63
Richardson, TX 75080
United States

Aboca's on 75 and Arapaho

Aboca's on 75 and Arapaho
100 Central Expy, Suite 63
Richardson, TX 75080
United States

The Wire Association International’s Wire Expo to Co-Locate with the Electrical Wire Processing Technology Expo (EWPTE) May 6-7, 2026

The Wire Association International Inc. (WAI) announces plans to co-locate its biennial Wire Expo with the Wiring Harness Manufacturer’s Association (WHMA)/Global Electronics Association’s Electrical Wire Processing Technology Expo (EWPTE) May 6-7, 2026. The two shows will co-locate at the Baird Center, Milwaukee, Wisconsin, USA.

The adjacency of the Expos brings together the complete wire and cable ecosystem under one roof, creating meaningful opportunities for industry professionals to explore the entire value chain. The co-location enables manufacturers, suppliers, distributors, and end-users to see and experience novel technologies, forge strategic partnerships, and advance the industry. 

Championing the Partnerships

Commenting on the events, WAI’s First Vice President David Fisher said, “I am looking forward to the Wire Expo and the EWPTE being held together next May. It’s a great chance for both groups to co-mingle and truly get a feel for each side of the wire and cable industry—from manufacturing to downstream end use, and all the products and equipment that go into it. The people who make this happen are key to the success of both groups.”

“We couldn’t be more excited to have the Wire Expo back to Milwaukee and to continue our great partnership with the Electrical Wire Processing Technology Expo,” said Wisconsin Center District Vice President of Sales Megan Seppmann. “Thanks to the recent expansion of Baird Center, we’re uniquely positioned to host these two exceptional international trade shows side by side, unlocking a more dynamic and immersive experience for all attendees. Our expanded convention center makes it possible for both events to thrive simultaneously. We can’t wait to welcome global guests to our state-of-the-art venue and showcase the best of Milwaukee’s signature Midwestern hospitality.”

“The co-location of the Wire Expo and the EWPTE will create a unique opportunity for attendees to collaborate, establish valuable new contacts, and learn from industry leaders and experts,” said David Bergman, VP, international relations, Global Electronics Association, and executive director, WHMA. “I’m pleased for all our members and attendees to be able to participate in these two outstanding trade shows in one place.”

Event Details

Date: May 6–7, 2026

Location: Baird Center, 400 W. Wisconsin Avenue, Milwaukee, Wisconsin, USA

Hours: 9:00 am–5:00 pm CT (May 6) and 9:00 am–3:00 pm CT (May 7) 

Access: Reciprocal access to both exhibition halls is offered during exhibit hours (except for exclusive reception times).

Registration

• Wire Expo: https://wireexpo26.com 

• EWPTE: https://www.electricalwireshow.com

Building on Proven Success

The 2026 event marks the second co-location of these industry-leading trade shows, building on the inaugural joint staging in 2010 at the venue now known as the Baird Center, Milwaukee, Wisc., USA. The reunion comes at a time of industry growth and technological advancement, positioning the combined event as a catalyst for discovery and collaboration.

Electronics Industry Wrestles with Cost Pressures and Weaker Profitability

The Global Electronics Association Releases June Sentiment of the Global Electronics Manufacturing Supply Chain Report

Electronics manufacturers are facing rising material and labor costs according to the Global Electronics Association’s June Sentiment of the Global Electronics Manufacturing Supply Chain Report. The Material Costs Index is above its long-term average and has not been this high since March 2023.

 

Despite market volatility, product demand shows resilience, rebounding as strongly from late-2024 lows. Orders, backlogs, capacity utilization and shipments are each strongly in expansion territory.

 

Over the next six months, electronics manufacturers expect material and labor costs to remain high, while ease of recruitment is expected to remain challenging. Demand, however, will remain intact. Manufacturers anticipate relative stability in orders, backlogs, shipments and capacity utilization, suggesting slow but steady operations amid headwinds.

 

Shawn DuBravac, Ph.D., Global Electronics Association’s chief economist and report author noted, “Bottom line, as the electronics manufacturing supply chain enters the second half of 2025, it will confront stubborn input inflation, but a solid demand outlook. Tight margins, persistent hiring challenges, and targeted capacity shifts will keep cost control and operational agility at the center of decision‑making throughout the remainder of the year.”

 

Additional survey data show:

  • Global manufacturers, along with those in North America, are more likely to expect a decline in profit margins compared to firms in Europe and APAC.
  • Supplier inventory is rising more for electronics manufacturers in APAC than those in North America, Europe, and among those operating globally (multiple countries).
  • Over the next six months, orders are expected to decline more for firms operating globally than for those in Europe. 

These results are based upon the findings of the Global Electronics Association’s Current State of Electronics Manufacturing Survey, fielded between May 14 and May 31, 2025.

Read the full report.

Halfway Through, Heading Where? The Midyear Economic Check-In

Date
-

At the midpoint of 2025, the global economy remains caught between resilience and risk. Inflation is elevated but hasn’t spiked as sharply as some feared following the latest round of tariffs, at least not yet. Meanwhile, hopes for aggressive interest rate cuts are fading as the Fed remains cautious, labor market data is softening, and trade tensions remain high as new policies ripple across supply chains. 

In this timely economic briefing, Global Electronics Association Chief Economist Dr. Shawn DuBravac breaks down the forces shaping the back half of the year. From supply chain disruptions to geopolitical flashpoints, this session will offer a data-driven, industry-relevant look at what lies ahead. 

This live webinar that will help you cut through the noise and make more informed strategic decisions. 

What You Will Gain: 

  • Midyear Global Outlook: Revised projections and performance insights across key economies
  • Inflation & Interest Rate Watch: Why inflation hasn’t surged (yet), and what could change
  • Tariff Trends: A look at recent trade actions and their near-term economic impact
  • Labor Market Signals: What slowing job growth and rising claims may mean for businesses 
     

The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application

The Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry. The Global Electronics Association retains the IPC brand for the industry’s standards and certification programs, which are vital to ensure product reliability and consistency. 

 

Developed by the IPC Conductive Yarns for E-Textiles Test Methods Task Group, IPC-8911 defines key yarn categories, introduces a standardized designation system, and includes qualification and conformance requirements tailored to conductive yarns. The standard is supported by eight new IPC-TM-650 Test Methods, designed to evaluate performance characteristics such as conductivity, mechanical durability, and resistance to environmental and chemical exposures.

 

The task group included global experts from both textile and electronics sectors, with leadership from Joe Geiger of Bally Ribbon Mills and Sahar Rostami of Meta.

 

“This standard gives manufacturers tools to know what to ask for when ordering yarns and helps yarn suppliers understand the electrical needs their products must meet,” said Geiger. “It brings clarity to the entire process—acting almost like a recipe for building reliable e-textile systems.”

 

Rostami added, “IPC-8911 eliminates the guesswork. It gives developers, researchers, and engineers a common framework and accelerates R&D by reducing the need to reinvent the wheel when selecting and testing conductive yarns.”

 

By clearly defining the performance characteristics and communication protocols for conductive yarns, IPC-8911 supports faster product development, more consistent sourcing, and improved reliability for all e-textiles product applications, from consumer to medical to aerospace and defense.

 

The release of IPC-8911 marks a critical step in advancing e-textile integration—establishing conductive yarns as true electronic building blocks while supporting better collaboration between yarn suppliers, product developers, and OEMs and brands.

 

To purchase IPC-8911, visit the Global Electronics Association Store. To learn more or join the IPC Conductive Yarns for E-Textiles Test Methods Task Group and shape future updates, visit the committee home page.

 

Understanding PCB Microsection Preparation and Analysis 101

Remote video URL

On June 18, 2025, industry expert William Graver led an informative session on the fundamentals of PCB microsection preparation and analysis. This introductory webinar covered essential techniques for preparing microsections, interpreting analysis results, and identifying key indicators in solder joints, plating, and overall board structure. Designed for engineers, quality inspectors, and professionals involved in PCB manufacturing, the session provided practical knowledge to support quality control, troubleshooting, and failure analysis efforts.

Author(s)
William Graver
Resource Type
Webinar
Event
Webinar