North American PCB Market Shows Mixed Signals: Shipments Up, Bookings Soft

The Global Electronics Association releases PCB industry results for March 2026

The Global Electronics Association announced today the March 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08.

Total North American PCB shipments in March 2026were up 4.4% compared to the same month last year. Compared to the preceding month, March shipments were down 11.2%. March's year-to-date (YTD) shipments increased by 10.8% year-over-year (YOY).

PCB bookings in March were down 4.1% compared to the same month last year. March bookings were up 17.4% compared to the preceding month. March’s YTD bookings decreased 3.1% compared to the same period last year.

“The PCB sector was soft sequentially in March, recording declines in both shipments and bookings following a strong February, but the book-to-bill continues to point to a tight market,” said Dr. Shawn DuBravac, Global Electronics Association’s chief economist. 

3-Month Book-to-Bill

1-Month Book-to-Bill

Shipments 3-Month MA

Bookings

3-Month MA

Shipments YTD

Bookings YTD

1.08

1.13

0.7%

0.3%

10.8%

-3.1%

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. The Association publishes the PCB book-to-bill ratio by the end of each month.

Characterization of IC Chip Package IBIS Model and Signal Integrity

Date
- (Jul 21, 2026 | 9:00 - 10:00pm CDT)

This one-hour webinar presents an insight into the PCB Signal Integrity simulation and IBIS model characterization process.  A review of what exactly signal integrity simulation does on the PCB and at the system level.  A discussion on how the IBIS model is a default for analyzing IC Chips’ input/output waveform integrity.  The IBIS model is broken down for easier understanding of its operation and integration into the SI simulation.  In addition, a quick note on how to achieve accurate results for Signal Integrity simulation.

Cheah July 22

Speakers Bio: 

Cheah Soo Lan has worked on Signal Integrity simulation since the mid-1990s as a research and development engineer for the National Supercomputing Center and high-speed PCB design for the Advanced Electronics Laboratory in the defense sector and the Institute of Microelectronics in Singapore.  Cheah is familiar with various types of advanced test equipment, software simulation, and modeling techniques associated with the R&D job scope. 

Cheah is currently working as an MIT for IPC CID/CID+ Asia and continues to support the Global Electronics Association with online PCB Design I and PCB Design II courses as well as her upcoming Technical Overview of the Semiconductor Chip Industry course starting August 18th. 

 

IPC Builds-Standards Development Committee Meetings - Paris

Date
-

We're Building Better Electronics for a Better World

Join us for IPC Builds in September 2026

The Global Electronics Association, is pleased to announce that IPC Builds 2026 is now open for registration.

IPC Builds 2026 is a week-long series of standards development meetings to be held in Europe. 

Over the years, volunteers worldwide have participated in IPC standards development committee meetings to bring the most trusted standards for electronics manufacturing to the industry. In 2026, we’re excited to head to Paris for this traditional and industry-driving event.

Why Attend?

Committee Meetings

Make your voice heard and help ensure IPC standards reflect the real needs of the industry.

Your participation in standards development committee meetings is essential - your expertise helps drive the quality, reliability, and consistency that IPC standards are known for.

IPC Builds is centered on IPC Standards, giving you the opportunity to directly contribute to the guidelines your company, customers, suppliers, and even competitors rely on every day. Newcomers, industry veterans, trainers, and all individuals in the electronics industry are welcome. Participate and learn more about these critical industry documents.

IPC Standard Development Committees cover a range of topics, including: 

  • Materials
  • Design
  • PCB fabrication
  • PCB assembly
  • Factory of the Future
  • E-Textiles
  • 3D Plastronics 
  • Training 
  • other

Agenda

Registration Hours
Saturday, 19 September - Thursday, 24 September | 7:00 am-17:00 pm

Lunch Included each day 

Committee Meetings
Saturday, 19 September - Sunday, 20 September | All Day
Monday, 21 September - Wednesday, 23 September | All Day
Thursday, 24 September | Morning Only

All Day

Product Assurance

5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting 

All Day

Product Assurance

5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting

7-31A IPC-A-600 and D-33A IPC-6012 Joint Task Group Meeting

All Day 

Product Assurance
7-31F IPC/WHMA-A-620 Task Group

Data Generation & Transfer/Documentation
2-40 Electronic Documentation Technology Committee

 
Morning

Assembly and Joining
5-21JND Solder Paste Printing Task Group
5-21R Die Attach and Wire Bond for Automotive Applications Base Materials
3-11A Base Materials Committee

Rigid Printed Boards
D-33-AP Printed Board Additive and Semi-Additive Processing Subcommittee

Printed Board Design Technology
1-10D Material Selection for Design Task Group

Terms and Definitions
2-30 Terms and Definitions Committee

 
Afternoon

Product Assurance
7-31FT IPC/WHMA-A-620 Training Committee
7-34C 7712 Task group

Assembly and Joining
5-21H Bottom Termination Components (BTC) Task Group 

Process Control
7-25 Automated Inspection Process Control Task Groups

Fabrication Processes
4-14B ENIG Task Group
4-14H IPC-4558 Task Group

Embedded Devices
D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task group

Product Reliability
6-10D SMT Attachment Reliability Task Group
3-11G Metal Corrosion Task Group

Morning

Product Assurance
7-31BT IPC-A-610 Training Committee
7-34 IPC-7711/21 Rework, Repair and Modification
7-35 IPC-AJ-820 Task Group

Assembly and Joining
5-23A Printed Board Solderability
5-23B Component and Wire Solderability Task Group
5-24G Polymerics Standard Task Group
5-27A System in Package (SiP) Task Group

Base Materials
3-12A Metallic Foil Task Group

Cleaning and Coating
5-32G Residue Assessment Task Group

Electronic Product Data Description
2-18 Supplier Declaration Subcommittee
2-19A Critical Components Traceability Task Group

 

Afternoon

Product Assurance
7-31N Manual Magnification Aides Task group
7-34B IPC-7731 Task group
7-34T IPC-7711 7721 Training committee  

Printed Electronics 
D-67 Additively Manufactured Electronics Subcommittee

Assembly and Joining 
5-22F IPC-HDBK-001 Task Group
5-24C Solder Alloy Task Group

Cleaning and Coating
5-31D Cleaning Handbook Task group 

Electronics Product Data Description
2-17A IPC-CFX Standard Tasl group and 2-17B IPC-Hermes-9852 Standard Joint Task group Meeting
2-19F Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions Task Group 

Process Control
7-24A Printed Board Process Effects Handbook and 7-24B Printed Board Assembly Process Handbook Task Group Joint Task Group Meeting
V-ESDS ESDS Control Plan

High Speed/High Frequency Interconnections
D-22 RF/Microwave Printed Board Performance Subcommittee

Testing
7-12 Microsection Subcommittee

Morning

Product Assurance
7-31AT IPC-A-600 and IPC-6012 Training Joint Meeting
7-31K and 7-31H IPC-D-620 Task Group and IPC-HDBK-620
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group

Printed Electronics
D-60 Printed Electronics Committee

Assembly and Joining
5-21M Cold Joining/Press-fit Task Group
5-22BT J-STD-001 Training Committee
5-24A Flux Specification Task Group
5-24B Solder Paste Task Group

Cleaning and Coating
5-33A Conformal Coating Task Group

Electronic Product Data Description
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16D IPC-2581 Users Task Group

Flexible and Rigid-Flex Printed Boards
D-12 Flexible Printed Circuits Performance Subcommittee
D-11 Flexible Printed Board Design Subcommittee

 

Afternoon

Assembly and Joining 
5-21N Cold Joining/Press-fit Handbook Task Group
5-22AS Space and Military Electronic Assemblies Task Group

Base Materials
3-11J Metal Based Laminates for Printed Boards

Cleaning and Coating
5-33C Conformal Coating Handbook Task Group
5-33F Potting and Encapsulation Task Group

Printed Board Design Technology
1-14 DFX Standards Subcommittee
1-13 Land Pattern Subcommittee

High Speed/High Frequency Interconnections
D-23 High Speed High Frequency Base Materials Subcommittee

3D Plastronics
D-84A Plastronics Accelerated Reliability Testing Task Group

Morning 

Product Assurance
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group

All Day

Product Assurance

5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting 

All Day

Product Assurance

5-22A IPC-J-STD-001 and 7-31B IPC-A-610 Joint Task Group Meeting

7-31A IPC-A-600 and D-33A IPC-6012 Joint Task Group Meeting

All Day 

Product Assurance
7-31F IPC/WHMA-A-620 Task Group

Data Generation & Transfer/Documentation
2-40 Electronic Documentation Technology Committee

 
Morning

Assembly and Joining
5-21JND Solder Paste Printing Task Group
5-21R Die Attach and Wire Bond for Automotive Applications Base Materials
3-11A Base Materials Committee

Rigid Printed Boards
D-33-AP Printed Board Additive and Semi-Additive Processing Subcommittee

Printed Board Design Technology
1-10D Material Selection for Design Task Group

Terms and Definitions
2-30 Terms and Definitions Committee

 
Afternoon

Product Assurance
7-31FT IPC/WHMA-A-620 Training Committee
7-34C 7712 Task group

Assembly and Joining
5-21H Bottom Termination Components (BTC) Task Group 

Process Control
7-25 Automated Inspection Process Control Task Groups

Fabrication Processes
4-14B ENIG Task Group
4-14H IPC-4558 Task Group

Embedded Devices
D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task group

Product Reliability
6-10D SMT Attachment Reliability Task Group
3-11G Metal Corrosion Task Group

Morning

Product Assurance
7-31BT IPC-A-610 Training Committee
7-34 IPC-7711/21 Rework, Repair and Modification
7-35 IPC-AJ-820 Task Group

Assembly and Joining
5-23A Printed Board Solderability
5-23B Component and Wire Solderability Task Group
5-24G Polymerics Standard Task Group
5-27A System in Package (SiP) Task Group

Base Materials
3-12A Metallic Foil Task Group

Cleaning and Coating
5-32G Residue Assessment Task Group

Electronic Product Data Description
2-18 Supplier Declaration Subcommittee
2-19A Critical Components Traceability Task Group

 

Afternoon

Product Assurance
7-31N Manual Magnification Aides Task group
7-34B IPC-7731 Task group
7-34T IPC-7711 7721 Training committee  

Printed Electronics 
D-67 Additively Manufactured Electronics Subcommittee

Assembly and Joining 
5-22F IPC-HDBK-001 Task Group
5-24C Solder Alloy Task Group

Cleaning and Coating
5-31D Cleaning Handbook Task group 

Electronics Product Data Description
2-17A IPC-CFX Standard Tasl group and 2-17B IPC-Hermes-9852 Standard Joint Task group Meeting
2-19F Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions Task Group 

Process Control
7-24A Printed Board Process Effects Handbook and 7-24B Printed Board Assembly Process Handbook Task Group Joint Task Group Meeting
V-ESDS ESDS Control Plan

High Speed/High Frequency Interconnections
D-22 RF/Microwave Printed Board Performance Subcommittee

Testing
7-12 Microsection Subcommittee

Morning

Product Assurance
7-31AT IPC-A-600 and IPC-6012 Training Joint Meeting
7-31K and 7-31H IPC-D-620 Task Group and IPC-HDBK-620
7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group

Printed Electronics
D-60 Printed Electronics Committee

Assembly and Joining
5-21M Cold Joining/Press-fit Task Group
5-22BT J-STD-001 Training Committee
5-24A Flux Specification Task Group
5-24B Solder Paste Task Group

Cleaning and Coating
5-33A Conformal Coating Task Group

Electronic Product Data Description
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16D IPC-2581 Users Task Group

Flexible and Rigid-Flex Printed Boards
D-12 Flexible Printed Circuits Performance Subcommittee
D-11 Flexible Printed Board Design Subcommittee

 

Afternoon

Assembly and Joining 
5-21N Cold Joining/Press-fit Handbook Task Group
5-22AS Space and Military Electronic Assemblies Task Group

Base Materials
3-11J Metal Based Laminates for Printed Boards

Cleaning and Coating
5-33C Conformal Coating Handbook Task Group
5-33F Potting and Encapsulation Task Group

Printed Board Design Technology
1-14 DFX Standards Subcommittee
1-13 Land Pattern Subcommittee

High Speed/High Frequency Interconnections
D-23 High Speed High Frequency Base Materials Subcommittee

3D Plastronics
D-84A Plastronics Accelerated Reliability Testing Task Group

Morning 

Product Assurance
7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group

Registration

Who Should Attend?

This event is meant for all professionals with an interest in IPC standards development committee meetings, from newcomers to longtime industry committee participants and leaders. Your registration also includes networking opportunities and lunches. 

Registrations options

Registration is subject to a registration fee for Global Electronics Association members as well as for non-members.

Registration is valid for the entire event period. Participants are required to register whether they plan to attend all six days or only part of the event. The registration fee contributes to the overall organization costs and includes lunches for the full duration of the event.

Register now to secure your spot at IPC Builds 2026 and be part of industry change!

                                                   REGISTER NOW

Advance Registration

Process: Advanced registration is mandatory for all attendees. 

The registration fee will be 250 EUR for the Association Members and 350 EUR for non-Members.  

  • Member price : 250 EUR
  • Non-Member price : 350 EUR

The registration process will always prompt you to register and pay by credit card (Visa, Mastercard, or Amex) as a non-Member = 350 EUR. 

This will allow the Global Electronics Association to confirm your membership status before issuing any invoice.

As soon as your registration is processed, Global Electronics Association Customer Service will double-check whether your Company is a valid Association member. In case it is, then you will receive a 100 EUR refund directly to the credit card you have used for registration, before the final invoice is issued.

On-site Registration

On-site registration will be available for last-minute participants (payment by credit card only: Visa, Mastercard, or Amex). 

Given the timeline, it will not be possible to differentiate on-site Members and Non-Members, and additional processing costs will apply. Invoices for on-site registrations will be sent to participants after the event.

The on-site registration price is set at 400 EUR (whatever the membership status is at that time).

  • On-site Last-Minute price : 400 EUR

Event Venue & Dates

Hosted at the H4 Hotel Wyndham Paris Pleyel Resort in Saint-Denis, France.

A modern venue offering dedicated conference facilities and networking spaces as well as large hotel room capacity.

Address: 

H4 Hotel Wyndham Paris Pleyel Resort, 

149 Boulevard Anatole-France, 

93200 Saint-Denis,

France 

Dates: 19-24 September 2026

H4 Hotel Wyndham Paris Pleyel Resort Website

Hotel Wyndam Paris

 

Meeting room Paris
Hotel Information

The following room blocks are available for IPC Builds:

  • Hotel H4 Hotel Wyndham Paris Pleyel – Global Electronics Association has contracted a room block for you, and rooms are available - double room, price per night/169 EUR, includes breakfast for 1 person. 

Check-in and check-out dates can be adjusted until 20 August 2026 COB. 

Room block ends on 20 August 2026 and rooms remaining not attributed will be released after this date.

To take advantage of these room blocks, participants will have to book directly using this dedicated hotel hyperlink upon which the hotel will send participants their confirmation number directly. All rooms are payable at the hotel reception at time of check-in. 

Book Your Hotel Accomodation HERE

Important note: Hotel cancellations or modifications are free of charge until 20 August 2026 COB.

We can’t wait to welcome you to Paris, France in September 2026!

Contact

For more information, please contact:

Philippe Léonard, Global Electronics Association Europe Director

📧 PhilippeLeonard@electronics.org

Anatolii Kazmin, Europe Event Manager

📧 anatoliikazmin@electronics.org

Teresa Rowe, Senior Director Industry Standards 

TeresaRowe@electronics.org

Region

Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0

BRUSSELS, June 3, 2026 — The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package. This proposal marks a significant evolution in European policy by more fully recognizing the need to rebuild Europe’s electronics ecosystem from silicon to systems.

“If sovereignty is security, then the European Union is taking a critical step toward greater technological independence, and doing so in lockstep with industry,” said John W. Mitchell, President & CEO of the Global Electronics Association. “Our members are looking for a regulatory environment that empowers electronics companies. This proposal enables an environment where they and their customers can thrive.” 

By extending support beyond semiconductors to strategically important segments like printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs), while reinforcing support for IC substrates and advanced packaging, the legislation lays a strong foundation for a more sovereign and competitive European electronics industry that can serve Europe’s strategic sectors.

“We are proud to have championed this comprehensive approach to the electronics ecosystem over many years, including in our recent industry reports and stakeholder meetings with the European Commission,” said Alison James, Senior Director of European Government Relations at the Global Electronics Association. “We thank the Commission for its collaborative leadership and its commitment to equipping Europe’s economy and strategic industries for the immediate future and beyond.”

Additional Background
  • The Global Electronics Association has long advocated for Europe to implement a comprehensive electronics manufacturing strategy for the continent to ensure competitiveness.
  • See our Defence Report on Europe’s capacity & capability gaps.
    • From aerospace and defence, to healthcare and telecommunications, the EU has relied on non-EU sources for critical components, but today’s decision puts the continent on a course toward greater technological independence.
  • Read our Industry Report on Europe’s capacity & capability gaps in PCBs and electronics assembly for eight strategic European industries.

North American EMS Demand Remains Strong as Book-to-Bill Ratio Hits 1.36 in April

The Global Electronics Association releases EMS industry results for April 2026

The Global Electronics Association announced today the April 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36.

Total North American EMS shipments in April 2026 were up 3.1% compared to the same month last year. Compared to the preceding month, April shipments were down 6.5%. April’s year-to-date (YTD) shipments increased by 4.0% year-over-year (YOY).

EMS bookings in April increased 4.6% year-over-year and increased 4.0% from the previous month. April’s YTD bookings decreased by 0.8% compared to the same period last year.

“North American EMS bookings accelerated for a second straight month while shipments slipped from a strong March but held above last April. EMS order books remain health and the demand picture remains steady,” said Dr. Shawn DuBravac, Global Electronics Association’s chief economist. 

EMS book to bill ratio, April 2026

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. The Association publishes the EMS book-to-bill ratio by the end of each month.

 

North American PCB Bookings Surge in April as Sales Continue to Climb

The Global Electronics Association releases PCB industry results for April 2026

The Global Electronics Association announced today the April 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.

Total North American PCB shipments in April 2026were up 5.8% compared to the same month last year. Compared to the preceding month, April shipments were up 15.6%. April's year-to-date (YTD) shipments increased by 8.9% year-over-year (YOY).

PCB bookings in April were up 25.5% compared to the same month last year. April bookings were up 36.1% compared to the preceding month. April’s YTD bookings increased 4.1% compared to the same period last year.

"North American PCB demand picked up noticeably in April. The three-month book-to-bill ratio climbed to 1.24, its strongest reading in more than a year,” said Dr. Shawn DuBravac, Global Electronics Association’s chief economist. “The demand picture for PCB is firming and building backlog could help support production through the back half of the year.”

April 2026 book to bill ratio

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. The Association publishes the PCB book-to-bill ratio by the end of each month.