Quality AI is Only as Good as Your Data

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Quality AI is only as Good as Your Data – “Setting Yourself Up for Good AI Outcomes”
Know the Data – Capture the Data – Use the Data
The push to increase manufacturing operations through AI continues to surge. To ensure usable, accurate outcomes, an assessment of current operations is needed to establish an AI dataset that will serve as the baseline for analyzing and interpreting the process. A system needs to be established to report process improvements and corrective actions based on the baseline dataset. The quality plan can now be implemented using the baseline data, with enhancements to improve efficiency and reduce costs. Join our panel discussion and learn about the critical data needed to establish the Quality Process, establish the Quality Documentation & Compliance System to support the process, and to provide the Quality Manager, Production Manager, or Operations Manager with quality data to implement the Quality Process, Documentation & Compliance.

The takeaways will be to:
1.    Know the Data with Shop floor planning
2.    Capture the Data with Quality Plans & Compliance
3.    Use the Data to Isolate the defects, establish Sort & Inspection Criteria, & Implement Rapid Deployment with real-time reporting to ensure Good Quality Outcomes!

Panel image 5.2.26

Speakers Bio:

Warren Scurlock - Chryspac, Vice President Business Development
Warren is responsible for Business Development at Chryspac, including prospecting and acquiring new clients, while balancing quality assurance for active client projects. Business Development with Chryspac includes aligning with our client’s mission to provide Project Collaboration, Inventory Management & Operational Efficiencies. Warren has over 30 years of experience in Marketing, System Design, and Project Management, and a commitment to customers.

Linda Hapka - Chryspac, Vice President Operations
Linda manages project development and throughput for large corporate customers and supports the development of start-ups and entrepreneurs, along with staffing, training/upskilling, and facility management. Linda has over 35 years of experience in Operations Management and Business Development with a passion for being solution-driven, innovative, and delivering results.

Matt Kownick – Left Hand Engineering, Owner
Matthew Kownick is the owner of Left Hand Engineering and an accomplished engineer known for translating complex technical concepts into clear, actionable solutions. He brings a strong ability to balance big‑picture strategy with day‑to‑day execution, consistently recognizing how individual decisions influence broader organizational outcomes. Highly self‑motivated and detail‑driven, Matthew has led numerous projects from initial concept through successful completion, delivering results within demanding timelines while collaborating effectively across dynamic, multidisciplinary teams.

Andrew Steele – FactoryQA, Founder
Andrew Steele is the Founder of FactoryQA and a seasoned quality professional dedicated to helping QA teams eliminate administrative burden so they can focus on the work that matters most. With hands on experience on the production floor and years spent auditing manufacturers across North America, Andrew brings a deep understanding of the real world challenges quality teams face. His firsthand insight into the gaps and inefficiencies in traditional QA processes led him to create FactoryQA—an accessible, robust solution designed specifically to support and elevate modern quality operations.

 

 

 


 

Building Industry-ready Talent Through Standards-based Education

Sichuan Modern Vocational College advances IPC-A-610 certification as part of integrated training strategy

Recently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification. This single-session certification cohort sets a new benchmark for similar programs among vocational institutions. The large-scale certification initiative marks a significant step in embedding IPC standards into the college’s regular teaching system, representing a dual breakthrough in standardized education and scalable application, and providing a solid foundation for aligning vocational education with industry needs.

As the electronics manufacturing industry accelerates toward higher quality and reliability, demand for skilled talent has evolved from single-skill proficiency to a more comprehensive capability encompassing standards understanding, hands-on skills, and quality control. In response to these shifting workforce requirements, Sichuan Modern Vocational College has proactively aligned with industry trends by introducing IPC standards-based courses and certification programs. By integrating widely recognized industry standards throughout the talent development process, students are able to better align with real-world job requirements during their studies and acquire essential standards knowledge and practical skills in advance.

During implementation, the college tailored its approach based on program characteristics and curriculum design, adhering to the principle of integrating standards into teaching and aligning training with job requirements. IPC standards were systematically incorporated into practical training and coursework, establishing an integrated training model that combines theoretical instruction, hands-on practice, and certification assessment. Through structured training, professional guidance, and rigorous certification processes, the program ensures close alignment between academic content and enterprise requirements. This approach addresses the longstanding gap in vocational education that often emphasizes skills over standards, making teaching more relevant to real production scenarios, effectively shortening students’ transition period from campus to workplace, and laying a solid foundation for career readiness.

Sydney Xiao, President of the East Asia Region at the Global Electronics Association, highly praised the initiative, “Introducing international industry standards into academic programs is a key step in aligning talent development with industry needs. Compared with providing standards training only after graduates enter the workforce, equipping students with standards knowledge and application capabilities during their studies not only reduces training costs for enterprises, but also enables graduates to adapt more quickly to job requirements and achieve stronger career development.”

The IPC Education Partner Program continues to expand the introduction of standards-based courses and certification across various institutions, supporting the high-quality development of vocational education. Looking ahead, IPC China will further deepen collaboration with leading institutions, promote broader integration of IPC standards into academic systems, and cultivate more highly skilled talent aligned with industry needs, thereby strengthening the talent pipeline for the sustainable development of the electronics manufacturing industry.

For more information about IPC China Education Partners, please visit:
https://www.ipc.org.cn/about/partners

Panel Discussion: Ionic Contamination Assessment in ECU Manufacturing

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The discussion will deliberately consider both perspectives, including:

  • The benefits of controlling ionic contamination in electronic assemblies
  • ROSE‑based approaches for present and future ECU reliability requirements
  • Technical strengths and limitations of IC, including reproducibility and uncertainty
  • Approaches in defining and enforcing IC‑based ionic limits
  • Implications for manufacturing processes, specifications, and supplier qualification
  • Potential impact to supply‑chain

OEMs, tier suppliers, and solution providers will share perspectives on when increased analytical detail provides benefits. The discussion will focus on practical experience, historical context, and the balance between robustness, manufacturability, and cost.

EDIP Explained: Funding Opportunities for Electronics Companies

Date
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The Global Electronics Association, in cooperation with European Commission DG DEFIS, invites you to an exclusive webinar exploring the European Defence Industrial Programme (EDIP) and its upcoming funding opportunities for the electronics industry.

Scheduled for May 12, 14:00–15:00 CET, this session is designed for European electronics companies, both members and non-members, looking to better understand and position themselves for EU defence funding.

During the webinar, DG DEFIS experts will:

  • Provide background on EDIP and its newly published work programme
  • Outline the Industrial Reinforcement Actions (IRA) and the upcoming Key Electronic Components call
  • Explain how companies can participate in the application process
  • Answer questions during a live Q&A session

A key highlight of EDIP is the €122.25 million allocated through Industrial Reinforcement Actions to strengthen critical electronic capabilities. This includes funding opportunities across areas such as guidance and propulsion electronics, RF and laser modules, avionics, PCBs and IC substrates, batteries, power electronics, and semiconductor building blocks.

The Call for proposals is expected to open in June 2026 and close in February 2027, making this webinar a timely opportunity to gain early insights and prepare for participation.

This is a must-attend session for companies seeking to stay competitive and informed in the evolving European defence electronics landscape.

Global Electronics Association Expands Free Member Training Library with New Safety and Ergonomics Courses

Expanded training builds job-ready skills for faster onboarding and more productive manufacturing, with a real-world AI curriculum in development

The Global Electronics Association today announced three new complimentary courses in safety and ergonomics, expanding its member training library to help manufacturers onboard workers faster and improve production performance.

The new courses, Introduction to Safety Data Sheets (SDS), Chemical Safety in Electronics Assembly, and Ergonomics for Electronics Manufacturing, are designed to strengthen workplace safety, improve operational consistency, and accelerate workforce onboarding and upskilling. The courses are available now as part of the Association’s expanding training library, which is valued at $400 per employee.

The Association’s workforce and training ecosystem reaches more than 3,000 member companies and issues more than 140,000 credentials annually, supporting an industry representing more than $6 trillion in global output. Structured technical training has been associated with a 20-40% reduction in onboarding time and a 10-30% improvement in first-pass manufacturing yield.

“As manufacturing evolves, companies are looking for more than standards awareness; they need training that helps people do the job in real-world environments,” said David Hernandez, vice president of education, Global Electronics Association. “These courses are part of a broader effort to close the gap between certification and application, and to support workforce readiness at scale.”

In addition to the new courses, the Association continues to expand its broader learning ecosystem, which includes foundational training in component identification, electrostatic discharge (ESD), foreign object debris (FOD), and safety in electronics manufacturing. Existing courses in ESD, FOD, and safety are already available in multiple languages, while the newly introduced courses and component identification training are currently offered in English, with Spanish, French, German, and Chinese translations planned for upcoming releases.

Building a Comprehensive Workforce Development Pipeline

The expanded library is part of the Association’s broader workforce development strategy, connecting applied training with certification to improve productivity, quality, and competitiveness. This approach is designed to serve both employers and individuals by delivering measurable operational outcomes, including faster onboarding, reduced rework and scrap, improved productivity, and lower training costs.

Additional curriculum development is underway, including a structured series of courses focused on emerging technologies such as artificial intelligence, data analysis, inspection, and visualization in manufacturing environments. These future courses will build on the existing library to create defined learning pathways for operators, technicians, and engineers, supporting workforce progression from entry-level roles through advanced technical specialization.

In addition to training expansion, members continue to benefit from access to the Association’s Knowledge Hub, which provides technical resources including conference papers, webinars, and industry guidance. A newly released guidance document on Scope 3 Category 1 emissions accounting is also now available to support improved data accuracy and supplier engagement across the electronics value chain.

The Association’s workforce development programs support employers and workers through:

The Association also provides members with direct access to dedicated training specialists at no additional cost. These experts work alongside companies to strengthen workforce strategies, close gaps between training and on-the-job performance, and align learning programs with measurable operational outcomes. By serving as a strategic extension of member teams, the Association helps organizations build more effective, performance-driven workforces.

For more information on educational programs offered by the Global Electronics Association, visit www.electronics.org

 

WHMA's Annual Global Leadership Summit 2027

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WHMA's Annual Global Leadership Summit

The wire harness industry is constantly evolving with new technology and practices. The 2027 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this fast-changing landscape. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs and suppliers for companies that build wiring harnesses and cable assemblies.

  • Peer-to-peer networking provides countless opportunities for you to improve your business as you learn, share, and discover new approaches to the wire harness industry.
  • Learn from industry leaders at best-practices roundtables, technical education workshops, and keynote speakers.
  • Get the first look at cutting-edge technology in the Exhibit Hall featuring industry leading suppliers.

Invest in your business and your future at WHMA's Annual Global Leadership Summit!

Region
Omni Tempe Hotel at ASU

7 E University Dr
Tempe, AZ 85281
United States

Omni Tempe Hotel at ASU

Omni Tempe Hotel at ASU
7 E University Dr
Tempe, AZ 85281
United States

Evaluating Ruggedizing Polymers: Insights from Condensing Environmental Conditions

Member Download (pdf)

Evaluating the protective efficacy of ruggedizing polymers using condensing environments is an innovative approach that can help simulate real-world conditions. Protective polymers are increasingly utilized as electronic assemblies move to harsher environments, the combination of board level contaminants, moisture and electrical bias makes it difficult to achieve reliability in high-density electronic assemblies. Understanding their behavior under varying environmental conditions is crucial. We conducted a series of experiments using a novel condensation test set up to evaluate how moisture exposure (condensing environments) influences the durability of polymer formulations. Our findings reveal that both chemistry and uniformity significantly affect the polymers’ integrity and barrier properties. Coating deterioration on free edges leads to accelerated degradation in wet conditions, highlighting the need for optimized formulations tailored for specific environmental challenges. These insights contribute to the development of more resilient materials, enhancing their application in harsh settings.

Author(s)
Christopher Allen, Mahmood Bholat, Andi Duffy, Phil Kinner, Beth Turner, Cara Vallance
Resource Type
Technical Paper
Event
APEX EXPO 2025

Achieving Lower Voids with a Novel Preform Flux Technology

Member Download (pdf)

Many of today’s advanced electronic devices require the use of solderable preforms in applications, including solder thermal interface materials (TIMs), power module attach, and any other application where two surfaces need to be joined with a fluxed preform. The solder joint should be free of surface defects, volume defects, and/or voids. Voiding in solder joints can cause decreased thermal performance, hot spots, and in some cases, delamination. The next generation of developed preform flux greatly reduces the void quantity in solder joints compared to the current generation of preform flux. Unexpectedly, the “colder” the reflow profile, the better the voiding performance. For SAC305 alloys, the overall voiding across all substrates is reduced, on average, by about 28%, when used with the next generation of preform flux. When combined with a lower melting solder that sees a maximum reflow temperature of 210°C, the voiding is reduced by greater than 46%. Moreover, when coated on a pure indium preform and reflowed with a peak temperature of 170°C, the voiding is further reduced, yielding a solder joint that has a 67% reduction in solder voids compared to the current generation of flux coated preforms. This paper will review the genesis of this new flux technology and the testing done on various alloys and substrates, showing that this next generation of preform fluxes greatly reduces voiding compared to previous generation of preform flux.
Key words: preform, voiding, flux

Author(s)
Lee Kresge, Igor Faleichik, Dan McElhinney, Ricky McDonough, Ph.D., David Bedner
Resource Type
Technical Paper
Event
APEX EXPO 2025