The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area
array assembly has been adopted by many board designers and component assemblers. The range of devices underfilled has
been greatly expanded and now includes everything from very small silicon devices to stacked die assemblies,MEMS and
display devices. All of these applications have the common problem of smaller amounts of real estate that underfill materials
can be applied to. Additionally,in a number of applications,underfill materials are not allowed to contact die surfaces,
adjacent wirebonds or components.
This increased demand to limit underfill flow onto adjacent components has put pressure on dispensing companies to develop
techniques for putting down small fillets of underfill in a highly controlled manner. A high degree of control of a dispensing
needle tip usually involves slowing the dispensing system down so that a small needle can maneuver into position and
dispense into a tight space. This slows down throughput,therefore a new method of delivering underfill fluids in tight spaces
is required.
This paper will describe the work done to develop a jet capable of dispensing abrasive underfill materials,producing smaller
fillets and high throughput.

During the last several years there has been and continues to be an enormous investment by both governments and industry in
the development and manufacture of fuel cells. The United States,Japan,and European Union have invested billions of
dollars on research and development. Major Universities including MIT,Northwestern,and others have significant fuel cell
research projects. Many large multi-national corporations including all of the major automotive suppliers are investing
billions on fuel cell technology. Fuel Cells are being viewed as an environmentally friendly infinitely renewable fuel source
that will reduce the Unites States and other industrialized nations dependence on foreign oil.
Both large fixed portable fuel cells and portable fuel cells are being developed. Large fixed fuel cells have been available for
some time and are used to power industrial and commercial facilities. Some fixed fuel cells are now powering private homes
in some areas. The goal is to have “thousands” of fuel cell automobiles on the road in the next few years and the majority of
automobiles powered by fuel cells within 10 years. Portable fuel cells are being developed as battery replacements for cell
phones and other common battery powered items.
One of the major issues with fuel cell acceptance is the cost of the energy produced by a fuel cell versus the cost of energy
produced by the competing energy sources. There are several technical challenges to developing cost effective fuel cells.
One of the key areas to reduce fuel cell cost is the manufacturing cost.
Once solutions to the technical challenges are discovered and the cost reduced,high volume fuel cell manufacturing will be a
reality. Can and if so how can high volume electronics manufacturing technology be used to develop and implement high
volume fuel cell manufacturing?
This paper will discuss the use of high volume electronic manufacturing technology,specifically screen printing and mass
curing,in high volume fuel cell manufacturing.

This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the
joint research project "TLSD". By the use of temporary liquid solder joints,it is possible to ensure operating temperatures up
to 200°C or 250°C reliable. After the selection of a suitable base alloy it was possible to develop a stable interface between
liquid solder and solid base metal by special material developments and modifications. In the first step it was necessary to
prove the feasibility,the assembly and testing of functional demonstrators was the main task of the second step. A special
focus of testing was the development of suitable testing methods and strategies to show the reliability of assemblies. First
available results and an outlook for the further development of this new technology will be shown in this paper.

The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are
becoming mature and their reliability assessed. 3-D technology constitutes the technical core of the VIGOR project which is
integrated in the European Framework 5 Research & Technology. This European project is called VIGOR for Vertical
InteGration for Opto and Radio (sub)systems. Thanks to the work performed by the consortium members the performance of
the 3-D module will be significantly improved. Applications proposed include the stacking of a wireless module for
automotive,integrating digital levels and a high-frequency level. The applications developed will integrate opto-electronics
functions,i.e. containing optical,opto-electronic as well as electronic parts. To the best of our knowledge,no 3-D module
supplier proposes today these types of applications. As a scientific expertise,thermo-mechanical together with finite element
modelizations and simulations are very crucial. The purpose of this paper is to review with emphasis the different techniques
of 3-D module manufacturing and to focus on the technological developments and the reliability tests performed up to the
mid-term of the project.

The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This
paper reviews one of the single most important,but sometimes overlooked or taken for granted,aspects of the electronics
industry,The CAD Library Land Pattern.
Every electronic component requires a solder land pattern for PCB layout. The solder pattern can be placed into two categories.
· Meet all the industry standard requirements for the sole purpose of electronic product creation automation.
· Fail to meet the industry standard requirements and create electronic product creation chaos.
This paper will describe the industry standard requirements so EE Engineers,PCB Designers and PCB Assembly Lines can fully
automate their processes,become more efficient and productive. This of course will lead to faster product development cycles,
reduction in overall costs,and reduction in error rate. If correctly implemented,you can eventually achieve elimination of
duplication.
On the other hand,if you do not follow standardization,there are companies that exist that will gladly take your money to verify
whether the land patterns you created are correctly built. But,even if the component will fit the land pattern that you created,
there are still other factors,like “Zero Component Rotation”,that must be considered to automate the manufacturing process.
The CAD Library of the Future will be a “One World Standard Library” that will be accepted by the electronics industry to
eliminate duplication of effort and automate all of the engineering,design layout,manufacturing and assembly processes.
The following pages explain the criteria needed to create “The CAD Library of the Future”. But first,let’s meet the key players
whose goal is to standardize the electronics product development industry.

There are many ways of specifying units for many different measurements,and over the years they have developed a life of
their own. For example,length was once measured with glorious imprecision. In 100AD King Edgar of Saxony defined the
yard as the distance from the tip of the his nose to the end of his outstretched thumb. Useful measure that. Can you imagine
asking the King to “Come over here,I want to make sure this length of timber is one yard”? Or how about a “perch”?
Originally defined as “the total length of the left feet of the first sixteen men to leave church on Sunday morning”. Very
useful – Not! Then we have the roofing industry giving us copper thicknesses in ounces per square foot. How useful is that?
These days we are doing much better. Apart from some obscure methods of measuring various parameters,we find the most
universal systems are based on the pound,the inch and the second (“English” system) and the meter,gram and second,
known universally as the metric system and more specifically as the SI system for Systeme International d'Unites,
originally the system developed in France and adopted by Europe. Notice that time units are the same in both – a sign that
convergence is possible.

One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how
far technology would have progressed if not for the automation of computer design? CAD has had a major impact on
technologies available today,yet users of CAD toolsets take for granted the advancements that have been made throughout
the years.
This presentation,instead of focusing on CAD’s past,will take a look at the strength and weaknesses of today’s CAD
toolsets. We’ll take a look at where current development is taking these toolsets and we’ll even take a look into my crystal
ball to see how the future demand for electronic products will shape the toolsets of tomorrow (given that they still will have
to keep up with time-to-market,correct-by-design and all the other industry demands).

Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias to their printed circuit board designs. The basis for these
procedures is the IPC-2226,IPC-4104 and IPC-6016 HDI standards. The talk will cover: Microvia Platform Types and Examples,
General Requirements,Material Considerations,Mechanical/Physical properties,features sizes and constructions,Electrical
Properties and Thermal Management.

This paper presents a functional signature analysis method for the end-of-life management of products,particularly for
electrical-electronics and electromechanical applications.
Due to the fast (r)evolution of electronics and,related,software new functionality becomes available in at an increasingly fast
rate. This means that,quite often,products are economically outdated before the technical end-of-life of a product is reached.
This is a far from optimal situation; often good working products are discarded because they are economically outdated with
all negative side-effects not only in financial terms but also with respect to terms of ecology. In this respect the ability to
analyze and predict the (remaining) technical life of a product would enable manufacturers either to re-use good subassemblies
in the manufacturing process of new products or to design products with such design margins that economical
and technical lifetime match. This requires models with the ability to predict function performance degradation over life.
Therefore,this project aims at defining methods (and related tools) to extract the mentioned indicators by analyzing the
function performance over life and to have a single measure of the reliability performance to identify source of failure and
performance deterioration by signals available for external measurement.
The signature analysis method uses a complete new approach,which differs significantly from methods used in preventive
maintenance,designing for reliability,or on-line monitoring of quality characteristics in production processes. This paper
presents the signature analysis method. The protocol for carrying out the signature analysis is discussed and the application
of functional signature analysis for end-of-life management is reviewed.

This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate
the impacts resulting from the use of lead and lead-free solders during the manufacture and assembly of electronics. Formulas
for calculating individual impact categories are presented and briefly discussed. Actual impact scores resulting from the application
of this methodology within the LCA research being conducted as part of the Lead Free Solder Partnership are currently
being reviewed and will be presented in detail in a future publication.