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Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the
IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation for selecting "CAT" test
vehicles and testing and the project involvement. We relate some of the findings from the latest test project and
discuss some of what we have learned. This paper shows a few of the ways that CAT/IPC D-36 testing has been
used to determine supplier process capabilities,technology readiness,and design feature parameters. We provide an
overview of how supplier management utilizes the test results to evaluate existing and potential suppliers; to drive
for quality improvements; and to align parts to suppliers. Last we comment on the strengths and weaknesses of the
current state of the program from Teradyne's perspective.

Benchmarking of industry fabrication capability,feature tolerances and material property variation is essential to
aligning product requirements and industry capability. Statistical based characterization of feature tolerances and
material properties are being used to optimize system and silicon designs. Assessment of industry capability is used
to validate process improvements and ensure alignment with product.

New component packaging formats create the need for greater production process stability,reproducibility and
precision. This leads to a growing demand for process control solutions.
As manufacturers set zero-defect goals,process control solutions have been developed,which are going beyond
defect detection towards defect prevention. In order to reach those zero-defect goals it is necessary to develop a
comprehensive quality assurance (QA) strategy. Part of this strategy must be,to observe and continually correct the
different processes,which build the SMT process. The use of AOI (Automated Optical Inspection) systems plays a
central role in most of those strategies.

Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such as: (1) ultra-low
cost,(2) thin,light,and portable,(3) high performance,and (4) diverse functionality. The biggest bottleneck to
achieving these is typically not the ICs but rather the electronic packaging. System in Packaging (SIP) is a
packaging solution that provides the high performance and high flexibility package architectures that meets the
system demands.
System in packaging provides a unique packaging solution allowing designers to tailor high density and high
performance electronic systems into application specific packages at costs far less than custom,system on a chip
solutions. Depending on their application environment,SIPs provide for high levels of integration between
interconnect levels,passive elements,optoelectronic,digital,and RF functions. To achieve this,the predominant
chip to package interconnect strategies are die attach with wire bonds and flip chip interconnects on multi-functional
high density interconnect substrates. Of particular interest are flip chip solutions as the need for high I/O’s,high
performance and high speed has moved to the forefront in customer requirements. Flip chips provide increased I/O
counts,improved electrical performance,reduced cost,and smaller size.
In this paper flip chip interconnect technology is reviewed with particular emphasis on design for manufacturing for
system in packages to insure high yield production. Factors such as substrate design guidelines,bump design
guidelines,under bump metallization selection,interconnect materials selection,and underfill selection are
discussed. In addition,reliability requirements and test methods are also reviewed. A case study on flip chip blue
tooth module processing is presented.

To successfully navigate the transition from an entrenched Pb-based electronics manufacturing model to a fully integrated Pb-free manufacturing operation will require significant and coordinated modifications to many elements of currently operating electronics manufacturing organizations. Starting with the fact that no “drop-in” replacement for eutectic tin (Sn) - lead (Pb) solder exists,the demands of Pb-free production will alter most facets of the manufacturing organization,from higher temperature processing with more expensive Pb-free alloys,to specifying component and laminate requirements able to tolerate the new constraints,to formulating new approaches for testing,inspection and quality control,to understanding the unknown reliability of Pb-free products. The elimination of Pb from electronic products will impact companies across the entire organization,not just at the manufacturing level. This will include product designers,component engineers,purchasing and quality assurance departments,
sales and marketing groups,material vendors,assembly equipment suppliers,original equipment and contract manufacturers,and recyclers. Clearly there is no shortage of work that needs to be done to place our understanding of Pb-free electronics production on the same level as the Pb-based counterpart. This paper discusses the comprehensive experimental approach that Cookson Electronics Division has taken to address the conversion to an integrated Pb-free manufacturing operation. The initial focus has been on materials compatibility for Pb-free processing using statistically based experimental designs. The study investigates compatibility between several Pb-free alloys,board and lead finishes,and flux types for both wave and paste/reflow soldering,including extensive reliability testing of the Pb-free assemblies. The statistical methodology and the results from the study will provide guidance for the implementation of successful and reliable Pb-free processing and serves as a model for how to establish a dedicated Pb-free electronics manufacturing operation.

Optical connectors are used to connect optical devices to other optical devices or systems. The presence of these optical connectors makes it possible to switch conveniently from one device or system to another. However,each connection introduces a certain amount of insertion and return loss that can impact performance. Such losses are particularly critical at high-speed transmission. Many applications can only tolerate less than 0.1dB loss for a connection. This paper will examine the challenges that manufacturers and users face as they manufacture and/or use fiber optic connectors. This paper will also discuss the factors that influence the optical performance (insertion loss,return loss,etc.) of fiber optic connectors. The losses due to process problem,contamination,and the type of adapters used for connection will be considered.