Modern Wire Bonding in Package Assembly

Date
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Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenges, and emerging materials. Learn about pitch shrinkage demands, direct bonding to Cu on ULK substrates, and innovations like silver and gold-coated palladium copper wires. Explore key bonding techniques including thermosonic, ultrasonic, and thermocompression, plus new options for Cu wire coatings.

Perfect for engineers navigating next-gen packaging and reliability.

 

Tom Dory October 22, 2025

Speaker Bio:

Dr. Dory has extensive experience in microelectronics covering semiconductor fab processing and assembly, hybrid circuits, and package assembly & test. He has worked in many different aspects of semiconductor manufacturing, including plasma deposition, RTP, and packaging technologies, while at Intel Corporation. Dr. Dory retired from Intel in the Assembly and Test Technology Development Research division after 20 years in R&D. As Pathfinding Integration Manager of the Intel Substrate Technology Research Labs, he was responsible for the development of advanced packaging technology in the areas of MEMS, wafer-level bonding, stacked die packages, and line pitch reduction designs. He specialized in packaging and assembly, focusing on high-density substrate manufacturing and chip assembly, including wire bonding, flip chip, and 3D packaging.

Dr. Dory was a lecturer on the Arizona State University chemical engineering faculty, teaching semiconductor processing and all transport phenomena. He is the author or co-author of over 35 patents and publications in the areas of semiconductor chemicals and package design, including underfill applications and embedded package capacitors. He is a member of the Electrochemical Society and a Senior Member of IEEE. 

 

 

 


 

Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics

Date
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Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics - A Non-Technical Guide to Component Authentication

Join SAE G19A subcommittee expert Anthony Bryant for an essential one-hour webinar focused on supply chain integrity and counterfeit electronics prevention. This session is specifically designed for non-technical personnel working in the electronics component supply chain including procurement professionals, supply chain managers, quality assurance staff, and business leaders.

With counterfeit electronics reporting increasing by 25% in 2024 to over 1,055 suspect parts, the threat to supply chain integrity has never been more critical. This webinar will equip attendees with practical knowledge to identify red flags, understand current trends, and implement effective counterfeit mitigation strategies that protect both business operations and end-user safety.

Key Learning Outcomes:
• Understand current counterfeit electronics trends and their business impact
• Learn visual inspection techniques requiring no technical background
• Identify documentation red flags and fraudulent paperwork
• Recognize supplier risk indicators and sourcing vulnerabilities
• Implement practical counterfeit avoidance strategies
• Understand regulatory compliance requirements and industry standards

Target Audience: Procurement professionals, supply chain managers, quality assurance personnel, business leaders, and anyone involved in electronics component sourcing and management.

 

Anthony Bryant September 24

 Speaker Bio:

Anthony J. Bryant is a trained expert in component counterfeiting detection techniques. He has collaborated with The Global Electronics Association on intermediate-level courses and webinars related to counterfeit electronics detection. With over 35 years of experience in the electronics manufacturing industry, Bryant witnessed the pervasive issue of substandard and counterfeit electronic components.

His journey began in the U.S. Navy, where he served as a fire control missiles technician (FCM). This firsthand experience highlighted the critical importance of reliable electronics in mission-critical applications, and he saw the consequences of equipment failures.
Transitioning to the civilian sector, Bryant pursued a career in aerospace and defense contract manufacturing. His commitment to quality led him to seek advanced training at leading electronics institutions, including ACI Technologies Inc. (formerly known as the American Competitiveness Institute) in Philadelphia.

During the COVID-19 pandemic, the problem of counterfeiting escalated significantly. Bryant personally encountered 19-20 instances where parts previously identified, rejected, and confiscated by the government resurfaced in the supply chain. This recurring cycle of non-conforming materials poses a persistent threat to the electronics supply chain.

His dedication to safety and national security stems from his service in the U.S. military, where he witnessed the catastrophic consequences of substandard equipment. Bryant’s expertise contributes to addressing the challenges posed by counterfeit electronic parts in high-reliability organizations. 
 

 

 


 

WHMA's Annual Global Leadership Summit

Date
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The wire harness industry is constantly evolving with new technology and practices. The 2026 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this fast-changing landscape. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs and suppliers for companies that build wiring harnesses and cable assemblies.

  • Peer-to-peer networking provides countless opportunities for you to improve your business as you learn, share, and discover new approaches to the wire harness industry.
  • Learn from industry leaders at best-practices roundtables, technical education workshops, and keynote speakers.
  • Get the first look at cutting-edge technology in the Exhibit Hall featuring industry leading suppliers.
JW Marriott Las Vegas the Resort & Spa

221 North Rampart Boulevard
Las Vegas, NV 89145
United States

JW Marriott Las Vegas the Resort & Spa

JW Marriott Las Vegas the Resort & Spa
221 North Rampart Boulevard
Las Vegas, NV 89145
United States

Electrical Wire Processing Technology Expo

Date
-

Why Attend the Electrical Wire Processing Technology Expo (EWPTE)?
Produced by WHMA/Global Electronics Association, the ONLY trade association exclusively representing the cable and wire harness manufacturing industry including manufacturers, their suppliers and customers, EWPTE is where the industry comes together with more than 3,000 attendees and nearly 200 exhibitors to find solutions to challenging wire problems through training and education and for the opportunity to network with industry leaders and subject matter experts.

Attendees at all career stages can expect to Harness the Future through:

  • Education & Training
  • Professional Development Courses with content designed to deliver new information, skills, and techniques related to the cable and wire harness industry.
  • Technical Conference Sessions presented by engineers, researchers, academics, technical experts, and industry leaders who will share new technical data, significant results from experiments and case studies, emphasizing new techniques and discussing trends of interest with appropriate technical test results.
  • Networking Opportunities by connecting with industry leaders and subject matter experts.
  • Accessing New Technologies and finding new suppliers to find solutions to your challenging wire problems on the show floor from nearly 200 exhibitors.
    Who Should Attend?

Anyone who designs, specifies, purchases, installs, sells, maintains or manufactures electronic cable assemblies, cord sets, wiring harnesses and other related products for the following industries:

  • Aerospace
  • Automotive/Transportation (Automobiles, Rail, Buses. Trucks)
  • Consumer Technology (Business Equipment and Appliances)
  • Defense/Military
  • Medical Instruments
  • Off Highway (Constructions, Agriculture and Mining)
  • Recreational (RV, Marine OPE & RTV)
Baird Center

400 W Wisconsin Ave
Milwaukee, WI 53203
United States

Baird Center

Baird Center
400 W Wisconsin Ave
Milwaukee, WI 53203
United States

Hand Soldering Competition Estonia 2025 Regional Qualification

Date
- (1:00 - 9:00am CDT)

Join the Hand Soldering Regional Estonia 2025 Competition, for Students and Professionals, being held 21-23 October 2025, at TalTech University (Main Lobby), Tallinn, Estonia. 

Competitors will demonstrate their soldering skills on a complex printed circuit board assembly within 60 minutes — for prizes, recognition, and the chance to secure a spot at the IPC Hand Soldering World Championship later in 2025. This year, we will hold a student competition 21 October and a professional competition 22-23 October. 

Student Competition:

21 October 2025

Students will compete in a dedicated category designed to showcase the next generation of soldering talents.

• Competition format: soldering a PCB assembly under IPC criteria, judged by IPC Master Instructors (MITs).

• Open to all students from Estonian universities, colleges, and technical schools.

• Tools and materials provided. 

• Best student (winner) will receive a cash prize. 

Register Student Competition

 

Professional Competition

22-23 October 2025

Professional competitors must solder a complex PCB assembly under IPC-A-610 Class 3 criteria, supervised and judged by IPC Master Instructors (MITs). Evaluation criteria:

•             Quality of the assembly process

•             Overall quality of the soldered assembly

•             Electrical functionality

•             Overall time recorded

Cash Prizes will be awarded to top performers:

First place - €300

Second Place - €200

Third Place - €100

The 2025 Estonia Champion (professional) will be invited — with travel expenses covered by IPC — to compete at the IPC Hand Soldering World Championship during Productronica in Munich, November 2025.

Best Company Team Award 

Companies can enter two or three competitors for the Hand Soldering Best Company Team Award. The combined top scores from entrants within each company will determine the winning team.

Register Professional Competition 

 

Registration Details 

  1. There is no charge to register for the Hand Soldering Competition

  2. No membership or certification is required for participation 

  3. All assembly tools and materials will be provided

  4. Complete the correct registration form to reserve your spot 

  5. A confirmation email will be sent to you 

For additional questions please contact Philippe Leonard, Global Electronics Association Europe, Director: philippeleonard@electronics.org

VENUE:

TalTech University (Main Lobby) — Thomas Johann Seebeck Department of Electronics - School of Information Technologies

Ehitajate tee 5, Tallinn, 19086, Estonia

Region
Tallinn University of Technology (TalTech) | Tallinna Tehnikaülikool

Ehitajate tee 5
19086 Tallinn Harjumaa
Estonia

Tallinn University of Technology (TalTech) | Tallinna Tehnikaülikool

Tallinn University of Technology (TalTech) | Tallinna Tehnikaülikool
Ehitajate tee 5
Tallinn, 37 19086
Estonia

The Shifting Global Economy: What Business Leaders Need to Know Now

Date
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The world economy is entering a new chapter marked by uneven growth, persistent inflationary pressures, and shifting trade dynamics. The United States shows resilience, Europe continues to face stagnation risks, and Asia’s mix of advanced and emerging markets is driving both opportunity and volatility.

In this virtual event, Global Electronics Association Chief Economist Shawn DuBravac will cut through the noise to provide a clear, global view of where the economy stands today and what lies ahead. Attendees will gain insights into the trends shaping growth, inflation, and investment in the back half of 2025 and into 2026, and leave with practical guidance for navigating uncertainty in an interconnected world.

What You’ll Gain:

  • A global perspective on economic trends across the United States, Europe, and Asia, with insights into what’s driving growth and where risks are emerging.
  • An understanding of key forces shaping inflation, trade flows, consumer behavior, and investment patterns in the year ahead of 2025.
  • Actionable guidance to help leaders anticipate challenges, seize opportunities, and make informed decisions amid uncertainty.

This virtual event is designed for business leaders, decision-makers, and professionals in the electronics industry—and beyond—who need a clear, global perspective on economic trends to guide strategic planning and investment decisions in the year ahead.

The Global Electronics Association Launches Design Village at APEX EXPO 2026

Calling industry leaders to shape the future of electronics design

APEX EXPO, the hallmark electronics tradeshow hosted by the Global Electronics Association, announced today the launch of the Design Village, a new feature in the exhibit hall that will unite the world’s leading innovators and showcase next-generation solutions for the electronics industry. The Design Village offers companies a platform to demonstrate technologies that provide comprehensive design and production solutions spanning component to system-level packaging.  

 

The addition of the Design Village reflects the industry’s accelerating demand for integrated design-to-manufacturing workflows, next-generation technologies, and sustainable electronics development, including vendors of design and simulation, digital manufacturing, innovative supply chain management, and AI-driven sustainability solutions. 

 

At the center of the APEX EXPO Design Village will be the all-new Technology Pavilion, which will feature three days of technical presentations, expert panel discussions, and real-time demonstrations. Design Village exhibitors will have exclusive, first-access to presentations in the Technology Pavilion and visibility to an audience of over 7,200 attendees representing more than 40 countries.  

 

“Everything starts with design,” says Matt Kelly, chief technology officer and vice president, standards and technology. “The future of electronics depends on chip-package-board-system co-design and co-optimization. This is why we are inviting companies spanning the design value chain to participate in the Design Village to lead this conversation, showcase disruptive technologies, and amplify their offerings to industry."

 

Application Process Now Open

Companies interested in joining this transformative initiative can apply immediately. Early applicants receive priority consideration for Technology Pavilion presentation slots and prime exhibition locations. To learn more, visit: Design Village and Technology Pavilion | APEX EXPO 2026 

 

About APEX EXPO 2026

APEX EXPO is the largest event for electronics manufacturing in North America, featuring a technical conference, exhibition, and professional development courses. It is a comprehensive industry experience connecting professionals across the entire electronics ecosystem.  APEX EXPO 2025 welcomed 7,235 visitors from 42 countries. For information on exhibiting, contact Alicia Balonek, senior director of trade shows and events at AliciaBalonek@electronics.org

The Global Electronics Association Hosts Successful WorksAsia-AI and Factory of the Future Technical Seminar

Reveals Four Key Trends: AI, Robotics, and Sustainable Transformation

On August 22, 2025, the Global Electronics Association hosted the successful WorksAsia-AI and Factory of the Future Technical Seminar during the exhibition Automation Taipei 2025. The seminar brought together 81 representatives from 58 companies, focusing on the latest applications of AI in smart factories and unveiling four key directions that will drive the electronics industry’s transition toward intelligence and sustainability.

The Global Electronics Association emphasized that the deep integration of AI and robotics has become the key driving force for smart manufacturing transformation. Taiwan is steadily advancing from a hardware manufacturing powerhouse to a new milestone of smart manufacturing innovation.

IPC Standards Driving Smart Factory Connectivity

The seminar featured Chuck Li, Standards Director, East Asia, Global Electronics Association, and Ronglun Li, Technical Director of Sunjsong  Technology, who introduced the latest IPC standards and solutions, including IPC-CFX-2591 (Connected Factory Exchange), IPC-Hermes-9852 (The Global Standard for Machine-to-Machine Communication in SMT Assembly),

IPC-2581, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology), and IPC/DAC-2552, General Electronic Components Model-Based Definition (MBD) Standard.

These standards help enterprises:

  • Enable end-to-end digital workflows from design to manufacturing (DPMX+CFX closed-loop solution)
  • Enhance equipment cross production line and cross-factory interoperability with true “plug-and-play” capability
  • Support digital twin, virtual verification, and supply chain traceability, reducing costs and improving yield

Global Electronics Association stressed that the continuous update and global promotion of IPC standards will remain the cornerstone of Industry 4.0 and smart manufacturing transformation.

Key Highlights of the Seminar

Industry experts shared cutting-edge practices and case studies in smart factory applications:

  • AI + Digital Twin: A New Engine for Factory Integration
    Peter Peng, Division Director at Delta Electronics, demonstrated the DIATwin digital twin platform, powered by NVIDIA Omniverse. The platform shortens the cycle from new product introduction (NPI) to mass production (MP), while optimizing processes, coating simulations, and human-machine collaboration. This showcases the practical transition from automation to true intelligence.
  • CFX  + HERMES: Accelerate the transformation and upgrading of intelligent manufacturing
    Jeffery Li, Director at MiTAC Computing Technology, shared their experience implementing IPC-CFX-2591 and IPC-HERMES-9852, solving SMT production challenges such as long changeover times, inconsistent data, and low utilization. These standards enable real-time data exchange across machines and machine to system , achieving automated scheduling, parameter deployment, and dynamic job assignments for fully digitalized, intelligent production lines. Establish the underlying infrastructure for AI applications and build highly efficient digital production lines
  • AI Strengthening Supply Chain Resilience
    Accuris expert Reto Gurini highlighted AI applications in BOM management, demand forecasting, and supply chain operations. He noted that AI can accelerate decision-making, lower operational costs, and mitigate logistics disruptions—provided it is built on high-quality structured data and domain-specific models.
  • AI-Powered Inspection: A New Era of Quality Assurance
    Che-Wei Liu, Manager at Test Research, Inc. (TRI), introduced AI-driven inspection solutions across AOI, AXI, and SPI. With “AI Programming,” setup time is reduced by 85%, while “AI Verify Host” cuts manual re-inspection, significantly lowering false call rates and inspection costs. These solutions not only improve yield and productivity but also reduce reliance on manual labor.

Global Electronics Association Outlines Four Future Development Directions

The Association identified four strategic directions for the future of smart manufacturing:

  • Integration of Electronics Assembly Standards – Promote IPC-CFX-2591 and IPC-HERMES-9852 to accelerate cross-equipment connectivity and digital transformation.
  • New Frameworks for Quality Assurance – Establish AI-driven standards for process optimization, predictive maintenance, and automated decision-making to ensure quality and reliability.
  • Sustainability and Standardized Reporting – Advance best practices and standardized sustainability reporting mechanisms to clearly demonstrate progress in carbon reduction and environmental initiatives with digital capability.
  • Talent Development and Certification – Strengthen training and certification programs to cultivate a new generation of professionals equipped with IPC standards knowledge and AI application capabilities.

Taiwan as a Global Model for Digital Manufacturing

Winny Lin, Global Electronics Association Taiwan Director, stated, “Taiwan’s manufacturing industry is rapidly transitioning from its hardware advantage to innovation in smart manufacturing. Through standards, talent, and international collaboration, the Association will help position Taiwan as a global benchmark for smart manufacturing and drive the entire electronics supply chain toward a smarter, more sustainable, and higher-quality future.”

North American PCB Industry Shipments Up 20.7 Percent in July

The Global Electronics Association releases PCB industry results for July 2025

The Global Electronics Association announced today the July 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00.

Total North American PCB shipments in July 2025were up 20.7% compared to the same month last year. Compared to the preceding month, July shipments were up 11.3%. July's year-to-date (YTD) shipments increased by 7.6% year-over-year (YOY).

PCB bookings in July were up 22.2% compared to the same month last year. July bookings were down 5.5% compared to the preceding month. July’s YTD bookings increased 17.2% compared to the same period last year.

“North American PCB activity firmed in July,” said Shawn DuBravac, Global Electronics Association’s chief economist. “A pickup in shipments brought the book-to-bill into balance, indicating output is keeping pace with demand and demand remains strong.”

July 2025 PCB book to bill ratio chart 1
July 2025 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in the Global Electronics Association’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in the Global Electronics Association’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to 12 months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The Global Electronics Association’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. The Association publishes the PCB book-to-bill ratio by the end of each month.