Turning Workforce Funding Opportunities into Employer Success

Date
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Building on the themes from my recent Community Magazine article, “Unlocking Workforce Potential: Beyond Federal Dollars,” this webinar will unpack how employers across the U.S. can access a range of underutilized funding opportunities to support training and apprenticeship programs. We’ll explore how national, state, and private resources can be braided to offset costs, expand training capacity, and build sustainable talent pipelines.

While we’ll highlight recent examples—like the newly awarded Employment Training Panel (ETP) contract that supports California employers—our focus will be national, offering employers a practical roadmap for identifying, combining, and leveraging diverse funding sources to maximize workforce development impact.

This is a must‑attend online event for Training Managers, Learning & Development Directors, HR Managers, Workforce Development Coordinators, Grants Managers, and Administrators.
 

 

Victoria Hawkins

Speaker Bio:

Victoria Hawkins is the Director of Grants and Funding at the Global Electronics Association, where she leads strategy and execution of grant programs that accelerate innovation and support scalable technologies in the electronics sector.

With extensive experience in program development, financial stewardship, and stakeholder partnership, she has driven successful funding initiatives that enhance industry capacity and sustainability. Victoria is passionate about leveraging cross-sector collaboration to ensure equitable access to resources and transformative impact in emerging markets.
 

 

 


 

IPC Hand Soldering Competition 2026 - Regional Qualification United Kingdom

Date
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Join the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) at Farnborough International Exhibition Centre on 3-5 February 2026.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MITs) on their ability to solder a complex printed circuit board within a maximum time of 60 minutes, adhering to IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality, and the speed at which the assembly was produced.

Prizes for Professionals

The professionals will receive cash prizes: the winner, two runners-up.

  • 1st place – 300 €
  • 2nd place – 200 €
  • 3rd place – 100 €

IPC Hand Soldering World Championship: The winner will be invited by the Global Electronics Association (all expenses covered by the Global Electronics Association) to compete in the HSC World Final in November 2026 at electronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of 2 best competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge. You do not need to be an IPC member to take part. You do not need to be IPC-certified to take part.

How to register?

Complete the registration form to secure your competition slot.

You will receive a confirmation email specifying your date and time to compete.

For more information, please get in touch with Philippe Léonard, Global Electronics Association Europe director (PhilippeLeonard@electronics.org), or Anatolii Kazmin, Europe Event Manager: anatoliikazmin@electronics.org

Region
Farnborough International Exhibition Centre

ShowCentre, Etps Road
Farnborough
GU14 6TQ
United Kingdom

Farnborough International Exhibition Centre

Farnborough International Exhibition Centre
ShowCentre, Etps Road
Farnborough, GU14 6TQ
United Kingdom

Cable & Wire Harness Competition 2026 - Regional Qualification France

Date
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Introduced in France for the first time, the Cable & Wire Harness Competition (CWH) will take place during Global Industrie 2026 in Paris Nord Villepinte.

Participants will compete under timed conditions (60 minutes) using identical materials and tools, with results evaluated by certified IPC judges. Each competitor must produce a fully functional wire harness assembly within the time limit, in accordance with the provided drawings and standards.

Judging criteria include:  DOWNLOAD COMPETITION RULES

  • Crimp accuracy and quality of terminations
  • Correct routing, labeling, and bundling
  • Compliance with IPC/WHMA-A-620 workmanship standards
  • Overall appearance and functionality
  • Speed of completion

All tools and materials will be supplied. Participants should wear ESD-safe clothing or a company-branded coat (if any).

DOWNLOAD BILL OF MATERIALS

Prizes for Professionals

🏆 1st place: €300

🥈 2nd place: €200

🥉 3rd place: €100

Participation is free of charge. No IPC membership or prior certification is required. Registration is open to all professionals and apprentices working in cable and wire harness assembly.

⚠️ Places are limited — register early to secure your participation.

REGISTER NOW

You will receive a confirmation email specifying your date and time to compete

Contacts are:

📧 Philippe Léonard, Global Electronics Association Europe Director – PhilippeLeonard@electronics.org

📧 Anatolii Kazmin, Europe Event Manager – anatoliikazmin@electronics.org

Region
Global Industrie 2026 - Paris Nord Villepinte Exhibition Centre

ZAC Paris Nord 2
93420 Paris
France

Global Industrie 2026 - Paris Nord Villepinte Exhibition Centre

Global Industrie 2026 - Paris Nord Villepinte Exhibition Centre
ZAC Paris Nord 2
Paris, 93420
France

Historic First for Sustainability Reporting in Europe and Beyond

New sustainability reporting and due diligence rules establish benchmark for the electronics value chain

The Global Electronics Association welcomes the swift conclusion and approval of the Omnibus package on the Corporate Sustainability Reporting Directive (CSRD) and Corporate Sustainability Due Diligence Directive (CSDDD) by the European Parliament earlier today.

In a positive development for the electronics industry, sustainability reporting and due diligence requirements have been significantly simplified following a final vote today in the European Parliament. This milestone concludes months of negotiations among the European Parliament, the Council of Europe, and the European Commission. 

“The European Commission’s increasing use of omnibus packages reflects a shift in EU policymaking. The Omnibus I simplification represents a good first step in the right direction.” said Chris Mitchell, the Association’s chief advocacy officer. “For many years, the Association has fought for a meaningful reduction in the reporting burden imposed on electronics companies, and it’s great to see our efforts in Brussels bearing fruit. This action brings sensible, much needed administrative relief for both EU and non-EU companies.” 

The Omnibus not only eases unnecessarily onerous sustainability reporting and due diligence obligations, it also reduces the number of companies in scope. Key provisions of the Omnibus include postponing the implementation of CSDDD to give companies more time to prepare for the simplified requirements, removing the EU-wide civil liability regime, eliminating the climate transition plan requirements from CSDDD, and providing greater flexibility in the collection of due diligence data. 

“While the Omnibus I adoption is a welcome step forward, greater clarity is still needed on the implementation of these changes,” said Dr. Diana Radovan, the Association’s director of sustainability policy. “The deal still needs to be formally ratified by the Council before it can come into force. The devil is always in the details, so the industry will eagerly await the final legal language, which will be published in the European Journal in the coming weeks.” 

Dr. Radovan added, “Most urgently, businesses require clarity about obligations for climate transition plans under CSRD. For companies working towards CSRD-aligned disclosures, the recent revision of European Sustainability Reporting Standards (ESRS) will significantly impact planning and execution. To this end, we seek swift adoption of the revised ESRS through a delegated act.”

The Global Electronics Association will continue to advocate for sustainability policies that offer simplicity, while simultaneously delivering greater environmental and social outcomes. This work will remain a top priority in 2026 and beyond. 

Global Electronics Association Invites Electronics Design Professionals to the 2nd Pan-European Electronics Design Conference (PEDC)

Conference offers best practices for design for excellence in production

The Global Electronics Association invites designers, engineers, researchers, and productdevelopment leaders to attend the 2nd Pan-European Electronics Design Conference (PEDC), taking place 21-22 January 2026 in Prague. 

Hosted by Fachverband Elektronikdesign und ‑fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. 

The conference connects the European electronics industry and the scientific community, exploring the latest developments in electronics design from “silicon to systems.” Topics include design for excellence (DfX), tools and workflows to bridge software and hardware design, and electronic systems design process for electronics assemblies.

What is PEDC 2026?

  • A two-day programme of technical sessions and keynote panels covering the"silicon to systems" spectrum fully — from development and design tools to manufacturing and sustainability.
  • Conference tracks span AI and software tools, DfX, sustainable design and product lifecycle, and package-PCB-system co-design.
  • High-quality, peer-reviewed technical content and insights from European industry and academia.
  • Knowledge accelerator through network with peers, experts, and global leaders.

Key Conference Highlights

  • Opening special session: “AI in Product Development: Separating Hype from Reality” with industry leader Tomide Adesanmi, Circuit Mind; followed by a panel discussion featuring thought leaders from Altium, Cadence, Siemens and Zuken.
  • A dedicated track on sustainable design and processes, addressing circularity and lifecycle optimization.
  • Hands-on technical presentation featuring case studies in silicon-to-systems/package–PCB–co-design, showcasing advanced design integration strategies.

“With this newly formatted second PEDC, we want to build on the success of last year’s event,” said Peter Tranitz, senior director of technology solutions at the Global Electronics Association. “As with the first edition, a Europe-wide panel of experts will develop a high-quality technical programme that remains fully independent and free from commercial influence.”

For information on registration, visit: www.pedc.eu.

Global Electronics Association to Testify at USMCA Public Hearing; Industry Expert Chris Mitchell Available for Interviews

Chris Mitchell, Vice President for Global Government Relations at the Global Electronics Association, will testify before the United States-Mexico-Canada Agreement (USMCA) Review Hearing on Thursday, December 4, outlining the electronics industry’s priorities for strengthening North America’s competitiveness and supply-chain resilience. The Association’s 1,700 U.S. member companies operate in all 50 states and are central to the nation’s innovation economy, defense readiness, and technology leadership.

 

The Association’s testimony will address the critical steps needed to strengthen North America’s electronics ecosystem and improve supply-chain resiliency ahead of the 2026 USMCA joint review, which will influence the rules governing $1.93 trillion in regional trade. Mitchell will focus on ensuring that modernization efforts reinforce, rather than disrupt, the cross-border collaboration that makes American electronics manufacturers globally competitive. 

 

Media Availability: Mitchell will testify during Panel 4 (11:25 AM–12:00 PM ET) on December 4 at the U.S. International Trade Commission Building. He is available for background briefings ahead of the hearing and on-the-record interviews following his panel appearance. 

 

Key interview topics include:

 

  • Industry feedback from U.S. electronics manufacturers, suppliers, and design firms across the wire harness, printed circuit board, EMS, semiconductor packaging, and advanced systems sectors

  • Insights from Mitchell’s recent blog post, “Strengthening North America’s Electronics Backbone,” including the need for coordinated regional strategies to expand manufacturing, accelerate innovation, and reduce strategic dependencies

  • Findings from the Association’s October 2025 policy brief, “From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing,” examine the role of integrated supply chains in advancing U.S. competitiveness and security

  • Modernizing USMCA to reflect advanced electronics manufacturing 

  • Strengthening North American supply chains for semiconductors and adjacent electronics components

  • Improving cross-border regulatory alignment and trade facilitation

  • Enhancing workforce and R&D cooperation among the U.S., Mexico, and Canada

 

About the Speaker

 

Chris Mitchell leads global government relations for the Global Electronics Association, representing the world’s leading electronics manufacturers and suppliers. He has more than 20 years of experience in international trade, technology, and supply chain policy.