The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order to achieve a good quality PCB assembly,the time-temperature profile should be within the product and process specifications. This is determined by the solder paste,components and substrate tolerances. As a result,the accuracy of the profile becomes a critical element in the quality of the electronics assembly. The methods by which thermocouples (TCs) are attached to the PCB assembly,to record the profile as the PCB travels through the oven,significantly impact the measuring accuracy of the profile.
Many electronics assemblers do not have the luxury of sacrificing production PCBs and BGAs for the purpose of measuring their profiles. Yet they need to make sure that these assemblies are processed in spec.
Area-array packages have solder balls hidden under the package,making it particularly difficult to achieve the correct thermal profile. Improper melting of solder balls will lead to poor solder joint formation and will damage the BGAs or the entire assembly. These components also tend to be expensive and,hence,represent a particular challenge for assemblers.
The goal of this study was to identify a non-destructive method for TC attachment that provides a small offset to the “actual temperature under a BGA.”

For centuries,the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates,from cloth material to electronic circuit boards. One area of blade printing mechanics that have been reviewed many times is the angle of attack of the blade. Typically it has been tested from 45 degrees to 60 degrees to optimize the printing quality and efficiency. However,this typically ends up as a compromise,from fill characteristics (45 degrees) to print definition (60 degrees). This paper will present the revolutionary performance of the profiled squeegee blade,which has recently been developed to create a virtual multi angle of attack for unsurpassed process control for all types of stencil printing processes.

The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole,SMT / Glue attach components,Packages requiring die attach / SMT assembly. The concept is to print with a first print stencil which is thinner than the second print stencil. The second print stencil has relief pockets formed anywhere that the first stencil printed. It is useful for several applications:
Printing Solder Paste for Through-Hole and SMT
Printing Glue and Solder Paste
Printing Flux and Solder Paste
Printing Solder Paste for SMT and RF Shields
Printing Reservoir Solder Paste for multi-level boards
Printing Solder Paste and Reservoir Flux
Each of these applications will be discussed in this presentation.

The Printed Circuit Board (PCB) builds get ever more complex. With this the layer counts climb but the overall thickness remains the same. From this the cores of the build are reduced and the dielectric layers are reduced. When this happens there are more concerns regarding how these stack-ups can withstand higher voltage with the thinner cores. OEMs are making stronger requirements regarding dielectric withstanding. This paper will outline how the Electrical Test industry combats these requirements and provides solutions to adhere to these ever changing requirements. IPC states methods,ie TM-650 and IPC-6012 but these are guidelines. This paper will elaborate around these requirements regarding Condition A and Condition B from the TM-650 specification. The paper will also outline the opportunities around testing Dielectric Breakdown or HiPot. The paper will outline: HiPot Manual Testing HiPot Fixture Assisted Testing HiPot Full Automation Testing Voltages,dwell,ramp and current cutoffs will be explored. The paper will further extrapolate to educate OEMs the full guidelines regarding what HiPot testing is designed for and the difference for high potential individual net testing.
Reference Specifications: IPC-6012
IPC-TM-650
IPC-9252A

When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reliability of the product. Design anomalies and capacitive cores can further cause stress in the once thought streamlined process. Understanding how the machines and methods test the product up front may alleviate delays and unnecessary waste in what otherwise would have been conforming product and delivered on-time. From the OEM side the better understanding of how the methods and parameters work against the product can better inform the manufacturer of possible anomalies in the final inspection process. If these are communicated up front,unnecessary delays can be omitted.

CO2 technology offers electronic device manufacturers a robust platform for a variety of precision cleaning and machining
applications. Surface and substrate contamination such as flux residues,organics,particulate matter,outgassing residues,
ionic residues,and laser and mechanical machining heat can be addressed (uniquely) with this technology. Available CO2
processes include one or a combination of composite jet sprays,centrifugal liquid immersion,supercritical fluid extraction,
and both vacuum and atmospheric plasma surface treatments.
CO2 technology eliminates or significantly reduces both lean and green waste generation at the production operation level
(source) by modifying manufacturing processes such as precision cleaning and machining. Because it is safe and dry,CO2
technology can integrate directly into manufacturing processes and tools to provide in-situ cleaning and/or thermal control.
CO2 technology can be implemented in a variety of process configurations to meet the constraints of lean production layouts
and product flow requirements,including direct integration into existing production lines and equipment where the surface
contamination is being generated. CO2 is a very unique manufacturing agent that affords multiple cost reduction and
performance improvement opportunities for electronic device fabrication.
Exemplary applications include silicone contamination removal from a surface using a CO2 composite spray,hybrid CO2
particle-plasma pad surface preparation for gold wire bonding,ceramic flip chip defluxing using centrifugal liquid CO2,
surface residue removal using a CO2 composite spray following laser processing,particle removal from a CMOS image
sensor following wire bonding,and CO2-enabled laser machining of organic and ceramic substrates.

For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not an option. Within the electronics industry,this means that residues,either ionic or non-ionic,must be fully removed. Partially removed or untouched residues can lead to component and product failures resulting from electrochemical migration,dendrite growth and electrical leakage currents.
The goal of this study was to identify and qualify an aqueous cleaning process capable of removing combinations of no-clean flux residues for Class III electronic assemblies. Teamed with a global electronic manufacturing service (EMS) provider supplying electronics to the aerospace and medical industry,the Design of Experiment (DOE) developed was executed in two phases. Initial testing was completed utilizing EMS boards and final testing was validated using IPC test coupons and standards.

High pressure capillary IC allows you to:
Lower operational costs – water,waste,consumables
“Always Ready”
Improved system and analytical performance
Convenience
Rush samples
Enables high-resolution separations and Fast IC separations using new 4 µm particle columns
Expand separation capabilities
Smaller particle columns
Faster flow rates
Higher eluent concentrations using RFIC chemistry

With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contamination scenarios that may cause current leakage. Traditionally,with “no-clean” processes,the focus has been on the conductivity of flux residues,which can be measured with industry accepted techniques such as IPC J-STD-004B SIR (Surface Insulation Resistance) testing (IPC-TM-650 2.6.3.7). However,the manufacturing environment,especially in low-cost labor markets,and even on otherwise well-controlled shop floors,may be far from representative of the “perfect world.” Other materials may find their way on to the surface of the PCB,often introduced through negligent human activity and handling that may or may not have a negative impact on the electrical reliability of the device. This paper will discuss an experiment that was performed to investigate the effects of “contaminants” that could be measured with SIR testing. The contaminants were tested by themselves as well as in conjunction with a halogen-free,Pb-free,no-clean solder paste. The materials investigated as contaminants were: human skin oil/perspiration,high temperature reflow oven chain oil,pepperoni pizza grease,hand cream/lotion,and tap water.

•Developments of Printed FPCs
- PE resist for long FPCs
- Flexible Touch Sensor Panel(TSP) application
- Single-sided Printed FPCs
- Double-sided Printed FPCs
- Smart Printed FPCs