This paper reports on further developments for an innovative copper deposition technology that was presented two years ago at this conference. At that time,the innovative technology was described as a way to replace conventional sputtering and vacuum deposition techniques while achieving greater feature diversity,lower cost,and higher performance. The advancements reported here include the extension of the technology to deposit thin (depths of 0.1 to 10.0 microns) copper with good adhesion on the interior of via walls that have been pre-formed in the base material. This process extension has been demonstrated on vias as small as 25 microns in diameter and on thin (7.5 to 12.5 micron) polyimide base materials.

Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most important technologies of electronics devices with high reliability and guaranteed quality. The authors are developing a new concept of PCB’s for next decade generations to improved the techniques of which including more fine line circuitries,higher densities and narrower spaced conductor lines. An essential part of subject for this technology is to improve the weak copper adhesion peel strength on epoxy insulation materials. To obtain the good adhesion property of copper plating,it is now widely used the Pd Colloid Solution method. In order to further improve more excellent adhesion for next decade generation PCB’s,we are investigating Super Critical Fluid (SCF) method. In this paper,an attempt has been made to impregnate some metal complexes into epoxy resin and then decomposed the complexes to produce free metal in the resin by reduction . Using the deposited metal is efficient electro-less Cu plating can be achieved. We will discuss the selection of the metal complexes and impregnation conditions on the complexes as well as peel strength of the plating.

Base on our experience,HiP defect comes in various shapes and
forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those that look like an absolutely good solder joint.
Although the HiP detection rate on the 5DX AXI averages about 70%,this system is currently by far the most efficient tool in the industry to screen for such defects. After the flagged joints are verified at the 5DX repair station,the remaining marginal or questionable joints are sent to a high resolution manual 2D x-ray machine for failure analysis.

-BA flux: Water soluble BA flux has a higher HiP risk relative to NC BA flux,likely due to higher surface oxidation risks.
-Deflux: Washing process using water or DIW in combination with other solutions
may make HiP risk higher when compared to leaving flux residue as received*.
-SMT paste: HIP improved models have higher performance than standard LF paste.

The reader may wonder why „PCB? in the title is between quotes. The original objective of the paper was to lay a firm base for people who are involved in printed circuit board (PCB) design for LED applications to understand and predict the thermal behavior of their design. However,after reading the paper the basic achievement will be the notion that such a designer cannot focus on the PCB alone,she has to take into account the rest of the world too (by way of speaking of course). Hence,the paper is equally well suited to serve all designers dealing with one or more aspects of the total LED application,be it the LED itself,the thermal interfaces,the heat sinks or the luminaire.
First of all,the paper will discuss the reasons why thermal management is important,and then treat the basics of heat transfer: conduction,convection and the concept of thermal resistance. How to perform back-of-the-envelope calculations is another topic that is covered,as well as the non-trivial concept of heat spreading,required in later stages of a design phase. Before jumping to conclusions,the paper discusses thermal interface materials and the associated wrong use of thermal impedance as their characterization.

Today,the metal core printed circuit board (MCPCB) business is booming thanks to the rising popularity of LED TV. The majority of MCPCB is single sided. However,the demand for multi-layer board is increasing since the interconnection density becomes higher. There are several approaches for this problem. One of them is to press resin coated foil (RCF) on the single side MCPCB. And even though there are many RCF products,RCF with high heat dissipation is rarely available. Therefore,the industry is looking for new thermal RCF material for multilayer MCPCB.
To meet this demand,a novel RCF material with high heat dissipation has been developed. Alumina fillers have been carefully selected,surface treated and highly loaded to the modified epoxy resin system. Only good dispersion with high power mixing can secure the material which has more than six times the thermal conductivity,1.5W/mK,than that of conventional RCF. It also shows a good thermal stability,withstanding longer than 10min at 288C,which makes it suitable for lead-free process. The other properties of this material,such as copper adhesion,dielectric properties and
laser via whole processibility will be presented.

To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board assemblies (PCBAs) by removing Pb from solder. Based on the anticipated end to various exemptions and other market forces,high end server applications are now following suit. In addition,as the server/computer industry evolves,the requirements for speed and memory storage continue to increase,causing a need for higher levels of signal integrity along with greater density/mass of components and wiring within PCBA’s. This change to more dense/higher thermal mass components on PCBA’s and going to a Pb Free solder at higher melting temperature than SnPb Eutectic Solder will aggravate the temperature gradients that occur during reflow,causing major limitations when using standard IR/Convection reflow. Excessive temperature gradients can damage less massive components and less dense laminate areas of the PCBA’s. Consequently,other techniques need to be investigated,and the leading alternative is Vapor Phase Reflow. Vapor Phase Reflow is a legacy soldering method that was popular before the 1990's. Vapor Phase Reflow has a processing advantage: its thermal blanket possesses a much greater heat density than convection or IR heating. This reduces the temperature gradients across the board assembly,preventing sensitive components from exceeding maximum temperature limitations. One of the many concerns for implementing Pb Free Vapor Phase Reflow is the effect on solderability. The objective of this publication is to compare the solder wetting between Vapor Phase Reflow and Convection Reflow using a specific Pb Free (SnAgCu) SAC solder paste. This study will compare the amount of area the solder wetted,solder heights,wetting angles,and voiding.

It is well known that nitrogen inerting in wave soldering can significantly reduce dross formation and improve solder wetting. For lead-free wave soldering,the benefits of N2 inerting are even higher. However,there is still a lack of a mature N2 inerting technology for wave soldering,which largely impedes its wide application. This paper presents a new generation N2 inerting system for wave soldering to make the technology more cost effective and user friendly. Both lab-scale experiments and production trials were conducted,which demonstrats the following superior performances and benefits of applying the developed N2 inerting technology: 1) low N2 consumption for inerting,2) low tendency of diffuser clogging,3) low retrofitting cost,4) an option for flux vapor collection,5) reduced dross formation,6) reduced machine down time for cleaning,7) reduced flux usage,and 8) reduced soldering defects.

There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between these technologies is highly influenced by the following criteria: the bump size & pitch requirements,cost,and overall yield. As the bumping industry evolves,many of the deficiencies and trade-offs associated with the three bumping technologies are no longer acceptable. As a consequence,a significant transition is occurring toward a fourth bumping alternative: Solder Sphere Placement [2]. This technique offers wide flexibility in bump size (40-760um),very high bump yields (>>99%) and low cost (sphere price dominated).

In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI machines to report defects on boards after photo-printing or etching. On the other hand,AVI (Automated Vision Inspection) which sometimes also called FVI (final vision inspection) is still in early growing stage and not yet widely used in the industry.
AOI and AVI machines are both using cameras to visually find defects on PCB. But they are used in different stages of manufacturing process. AOI reports the defects on inner layers or outer layers which have only copper,base and drill holes. AVI reports the defects on final PCB products which have much more features such as solder mask,gold plate,silk screen…….
AOI and AVI machines are different kind of machines with different functions,but their working principles are very similar. Many technologies of AVI are built up from AOI. From user point of view,if there is a universal machine which can have the functions of AOI and AVI,then they may save cost,labors and space. This paper analyses on the combination of AOI and AVI to meet this objective. There are five parts in this paper. The first part focuses on the application of AOI and AVI and identifies all kinds of defects and boards which they can inspect. The second part compares the hardware and software of AOI and AVI machines. The commons and differences are found out. The third part studies of finding defects under the application and machine issues of AOI and AVI. The fourth part is to see the possibilities in combining AOI and AVI. The fifth part is to summarize the key elements that caused the Pros and Cons of the universal machine (or called combined machine).