This paper presents a comparison of several resin systems on different support reinforcements including on
Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems compared in this paper
include D53001 (Halogen-Free,High Tg or HFHT),N4000-13 (high-speed/low-loss or HSLL),and N4000-6 (high
Tg FR4 or HTFR). It is proposed that the HFHT resin can be used for high-signal speed applications,chip-test
boards,and in some cases,lead-free solder PCB processes. The parameters compared herein include thermal,
mechanical,dielectric (i.e.,stripline tests),flame -retardant character,and cure profile characteristics. This study
gives the chip-test board,backplane,and wireless base-station designer valuable information concerning the
functionality of these resin systems with different support reinforcements.

The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. For board designs requiring tight tolerance of an embedded singulated capacitor,knowledge of the influence of board design on the measured capacitance would be of interest. A designed experiment tested the effect of 3 factors: distance between capacitors (capacitator spacing),the presence of an additional ground plane in the board,and having a common ground for the adjacent capacitors. Test design,board construction,and resulting capacitance measurement data will be presented. The results showed that all 3 main factors and 1 interaction term were significant. The significant interaction was between capacitor spacing and common ground.

Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for
a particular product. Many programs simply default to a standard test without much quantitative analysis. With
product reliability and cost management pressures,developing realistic accelerated test criteria is vital. The
procedure described in this paper is based on substantial measured field environment data,a validated acceleration
model with a generalized product definition,and statistically based test requirements. While the particular example
is for commercial air transport avionics,the proposed procedure is easily extensible to other high reliability
applications.

Utilizing continuous lamination techniques,new materials are being developed to meet demanding market
requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effective products that
can be employed in RF and microwave applications. A family of unique products has been developed that
provide various solutions for microwave applications with electrical,mechanical,thermal and processing
characteristics that surpasses competitive products.
Today's high-speed electronic products also require cost-effective materials to enable timely market penetration
and sustained growth through subsequent cost reductions. The technical demands for these products have seen
operating frequency increase or data transmission rates increase to a point that high performance circuit laminate
must be employed to create reliable performance for the consumer. Until very recently,those applications
requiring high performance laminate materials had few options. Even with some of these existing material
options,laminate premium could be as high as 3-10 times and fabrication techniques required could multiply the
costs even further.

Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its surface. If this organic layer on the copper's surface is thick enough,it has a restraining influence on the conductivity of this electrode. The anode is becoming passive or the anode is polarized. In no small measure,polarization is dependent on the (anodic-) current density. Using the appropriate additives for the copper electrolyte and applying the right (anodic- )current density,polarization can be controlled and thus improving surface distribution of the electroplating deposition on a Printed Circuit Board.

The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor
chip design evolves into increasingly finer lines. First,it was studied how fine the conventional subtractive process
could build line and found that line/space of that process is limited to around 40/40,even if using some new
technologies. The next challenge was to find a process that can build line/space and get rid of some issues of the
additive or semi additive process. It was confirmed that the improved pattern plating process used with CSE
(Controlled Surface Etching) process is capable of making finer line/space circuits like around 25/25 microns. The
CSE process is characterized by a uniform etching of the base copper with an improved soft etching solution.

As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local areas of circuit boards,and via spacing of less than 10 mils. As the feature spacing gets smaller the probability for Conductive Anodic Filament (CAF) growth becomes significant. Many PWB designs now require the use of CAF resistant substrates to reduce the opportunity for CAF failures. Early solutions to CAF required use of Non FR-4 substrates such as Bismaleimide Triazine based materials. To meet the increasing requirements for CAF resistance and use the current PWB fabrication process,new FR-4 materials are needed. CAF is the growth of a subsurface filament from an anode to cathode. This is the result of an electrochemical corrosion process that causes deposits of corrosion byproducts along the fiberglass filaments to form. The current model of CAF formation and growth involves two steps,the physical degradation of the fiber/epoxy bond followed by an electrochemical reaction responsible for conductive deposits to form. There are many factors that can contribute to CAF formation. These are summarized in Figure 1. Efforts to develop FR-4 substrates more resistant to CAF growth have focused on both improving the Epoxy -Filament bond and reducing the probability of the electro-chemical reaction occurring by modifying the FR-4 resin chemistry and the nature of the silane finish on the fiberglass reinforcement. New more CAF resistant FR-4 products have been developed and are now available. The development of these imp roved FR-4 substrates demonstrates that epoxy based FR4 materials can be capable of meeting the requirements for CAF resistant high-density PWB designs. CAF test data comparing traditional FR-4 materials to new FR-4 products developed by Polyclad Laminates will be presented. These new materials have been shown to greatly improve CAF resistance.

With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure
mechanism is gaining a lot of attention. Smaller geometries make the printed circuit board (PCB) susceptible to
conductive anodic filament growth. Isola has carried out work to characterize the CAF susceptibility of various resin
systems under different process and design conditions. Tests were carried out to determine the effect of various
factors such as resin systems,glass finishes,voltage bias and hole and line spacings on the CAF resistance.
This work was intended to provide information to the user on the suitability of various grades for specific end use
applications. The focus of the work at Isola is to find the right combination of process and design conditions for
improved CAF resistant products.

Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system downtime has created an
increasing demand for understanding the loads imparted through a printed circuit board (PCB) to an individual
component on the board. Local stiffening of the circuit board can limit the component loads,however stiffening
devices can be costly to design and implement. They are also bulky,taking up valuable space on already crowded
PCBs. Both experimentation and analytical tools were used here to investigate how loads are transmitted through a
circuit board to an individual component.
Two case histories are presented that investigate how specific loads applied to a circuit board may damage
individual components. In the first case history,failures of surface mounted capacitors were occurring at some point
during the PCB assembly process. In order to isolate the specific step in the assembly process that was causing the
damage,miniature strain gages were adhered in several locations adjacent to the subject capacitors. The strains were
monitored as the instrumented PCB was put through its normal assembly process. The measured strains at the gage
locations were compared to the reported strength of the capacitors.
In the second case history,a PCB carrying a single ceramic column grid array (CCGA) package was subjected to
static and shock loading. Strain gages were adhered to the CCGA and the PCB near the CCGA to measure the level
and duration of static and shock strains imparted during typical PCB handling,and insertion into,and removal from,
a multiple board chassis. The highest magnitude shock loads resulted from PCB bending,and occurred as the printed
circuit board connecter contacted its mate on the chassis.
A finite element analysis of the circuit board and CCGA was conducted to infer from strains measured near the
CCGA the individual solder column loads that might result from the PCB insertion and removal. It is these pins that
sometimes fail during use. It is suspected that high pin loads from PCB shock loads significantly lower the lifetime
of a CCGA. CCGA pin loads are determined from the finite element analysis for a given PCB load,and compared to
the ultimate tensile strength of the subject material.

This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a
bottleneck in many PCB companies,and how a dedicated software system breaks the information bottleneck and
permits true collaborative engineering. There is now software technology that integrates and automates standard and
customized engineering processes to streamline workflow and collaboration,improve quality,reduce errors,and
reduce pre-production costs. With it,the productivity of an engineering department can increase dramatically,
reducing time-to-production and increasing customer order fulfillment rates. The need for rules,an extensible data
structure,and an open architecture in an intelligent,collaborative system is explained. The key characteristics of the
features and functionality are outlined. The benefits of such a system are described and how value is added to the
engineering function,the company,and customers.