A Case Study on Evaluating Manual and Automated Heat Sink Assembly using FEA and Testing

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Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However,an automated fixture is used whenever applicable. This paper will illustrate the use of strain gauge testing and Finite Element Analysis (FEA) as a simulation tool to evaluate and optimize the heat sink assembly process by manual and automated methods. Several PCBAs in the production line were subjected to the manual and automated assembly process. Strain gauge testing was performed and FEA models were built and run. Results were compared with the goal of improving the FEA model. The updated FEA model will be used in simulating different conditions in assembly. Proposed improvement solutions to some issues can also be verified through FEA.

Author(s)
Michael Randy Sumalinog,Jesus Tan,Murad Kurwa
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

EMI-Caused EOS Sources in Automated Equipment

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Electrical overstress causes damage to sensitive components,including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analyses sources of such noise,how it affects components and how to mitigate this problem.

Author(s)
Vladimir Kraz
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

Press Fit Technology Roadmap and Control Parameters for a High Performance Process

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Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes,Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering,rework,thermal cycles,installation and repair. This paper investigates the technical roadmap for press fit technology,putting special attention to main characteristics such,placement and insertion,inspection,repair,pin design trends,challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.

Author(s)
Jose Becerra,Dennis Willie,Murad Kurwa
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

Important Considerations in the Design of Solderless Electronic Assemblies

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Soldering has been a key process step in the manufacture of electronic assemblies since the earliest days of the electronics industry,it is also one of the most challenging processes to control and predict and a major source of defects and failure. For several years,the elimination of solder from the electronic circuit assembly manufacturing process has been suggested as a potential way to sidestep solder technology’s many short comings. Elimination of solder can in fact be relatively easily accomplished by simply reversing the manufacturing process. That is,rather than building printed circuits and then placing components and soldering to them together,it is here proposed that boards containing components,with the component’s planar terminations exposed on the surfaces of said component boards,have circuits applied to them using PCB buildup technologies which are now well established in the PCB industry. By bypassing the soldering process,the resulting assemblies offer significant benefits and improvement potential in terms of cost,reliability,security and environmental friendliness among others. While the manufacturing infrastructure to build such structures is fundamentally in place and ready to go,the design approach,mentality and some tools which are presently available are less ready. This paper will examine,by way of demonstration,the challenges associated with designing SAFE (solderless assembly for electronics) products. In the paper,a current product board is redesigned using all preferred case design rules which include,a fundamental grid pitch for all components resulting in a design which is substantially smaller than the original design and yet which are less challenging to the circuit manufacturer than most current leading edge designs. The paper will identify the limitations of current design tools relative to executing such designs and offer suggestions as to how those tools might be improved to make the manufacture of solder free electronic assemblies easier. It will also describe and suggest novel ways of integrating passive devices into such electronic assemblies to further conserve space and improve performance.

Author(s)
Joseph Fjelstad,Darren Smith
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

What is needed to Successfully Introduce "Device Embedding Technology" in Design and Manufacturing of PCBs and PCBAs to Add Value to Your Products?

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The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. Different technologies have been developed and were technically successful,but history has shown that these embedding developments did not result in a sustainable success over a longer period of time. Replacement technologies have been developed after a short period of time by the so-called “Not in Kind” (NiK) technologies often called disruptive technology. (e.g. From the viewpoint of a PCB fabricator the use of an “Inorganic ceramic material is a = “Not in Kind”,while a standard FR4.0 or FR4.1 is considered as an Organic = “In Kind” technology). The paper will explain what is needed to avoid technology pitfalls that will lead to business failures in future. In addition,opportunities are discussed that enable development managers,design engineers and specialists to use the full benefits of embedding devices in automotive,medical and industrial applications. These ‘enabling’ manufacturing technologies will offer the opportunity to develop innovative product solutions in critical technical,environmental and business situations.

Author(s)
Michael Weinhold
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

Embedding Passive and Active Components: PCB Design and Fabrication Process Variations

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Embedding components within the PC board structure is not a new concept. Until recently,however,most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable,many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance,companies have found that by reducing the component population on the PC board’s surface,board level assembly is less complex and the PC board can be made smaller. The smaller substrate,even when more complex,often results in lower cost. Although size and cost reductions are significant attributes,the closer coupling of key elements can also contribute to improving functional performance. This paper focuses on six basic embedded component structure designs described in IPC-7092. The process variations define the structure,depending on whether components are passive or active,placed and/or formed and if they are on one side of the PC board base-core or both. The formed and placed components may be located on any number of layers,however,formed components are generally assigned to dedicated layers. The layering description actually becomes part of the type designation that is very similar in describing an eight layer (2-4-2) HDI board and the naming indicates whether the base-core represents a final assembly or is simply a mounting base onto which additional layers are sequentially added.

Author(s)
Vern Solberg
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

Characterization of Solder Defects in Package on Packages with AXI Systems for Inspection Quality Improvement

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality,lower false call and escapes.

Author(s)
Zhen (Jane) Feng Ph.D.,David Geiger,Weifeng Liu Ph.D.,Anwar Mohammed,Murad Kurwa
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

Make the Right Design Choices in Load Switching and Simulation in a High Current and Mechatronic Functional Test

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In a typical mechatronic manufacturing functional test setup,actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. Each output is connected with different load and the test will either be sequential or concurrent. At lower power levels,these can usually be managed with general purpose switches. However,when it comes to higher power levels of currents more than 5 amps,such switching and loading might pose a greater challenge. Furthermore,critically in the manufacturing line,the tradeoff between cost and test time would have a great influence on the test strategy. This paper will present some key points to design a cost effective high power switching and load management solution. Firstly,we will discuss the selection process for the types of relays to be used in the switch methodology. Next,for automotive testing where high current measurements are typically done at the output channels,we will look into how this measurement is done; with or without loads and by instantaneous or continuous measurements. Then,we will discuss single load or multi load connections and explore different approaches. These connections provide simulation at different loading conditions. A typical example would be to emulate the steering wheel audio control button with different resistive loads. Subsequently,we will also discuss voltage protection and temperature cooling which are essential in such high power applications. Finally,we will give a bird eye’s view on the complete high level architecture of the combination of switch and load box,where usually the right solution is more than the sum of the parts. By providing the reader with guidance and tips on which design and methodology to adopt for the high power switch and load solutions,a cost effective while robust solution that promotes reusability of the test system in high mix test environment would be at your fingertips.

Author(s)
Derek Ong,Lok Teng Kee,Chuah Run Chia
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

A Study on Using Solid State Relay (SSR) in Automatic Test Equipment

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Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this paper will try to address these challenges and explore alternatives such as solid state relays as replacement.

Author(s)
Eric Xu
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015

Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue?

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The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible,thereby ensuring electrical reliability. But,of all the factors that play into the electrical reliability of the solder paste flux residue,is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question. Two commercially available SAC305,Type 4,no-clean solder pastes—one with a ROL0 and the other with a ROL1 J-STD-004B classification—were subjected to two different storage conditions (room temperature and refrigeration) and aged for varying lengths of time. After aging,the solder pastes were printed and reflowed using the same common reflow profile and then submitted to SIR testing to see what,if any,difference could be detected in their SIR performances. The reason for testing both a ROL0 and a ROL1 was to see if differences in chemistry could have an impact on how a solder paste ages relative to SIR performance.

Author(s)
Eric Bastow
Resource Type
Technical Paper
Event
IPC APEX EXPO 2015