U.S. EPA Fees for Toxic Substances May Apply to Your Company This Year
By Kelly Scanlon, director of environment, health and safety policy and research
Key Summary
• EPA TSCA Fees Rule may require manufacturers and article importers to pay fees for high-priority substances in 2020.
• Companies must review EPA preliminary lists and self-identify if they handle HP substances or risk daily penalties.
• No exemptions exist for articles, impurities, byproducts, or de minimis quantities under the TSCA Fees Rule.
• Fees per substance will be shared among listed companies, with small businesses receiving an 80 percent discount.
• Companies may join consortia to distribute TSCA fees after final scoping documents are released.
Manufacturers and importers of “high-priority substances” and importers of articles containing these substances may be obligated to pay fees this year to defray the U.S. EPA's costs for administration of the Toxic Substances Control Act (TSCA). Many companies may be unaware of these potential fee obligations, especially importers of articles that contain HP substances by design or as byproducts or impurities. The regulation imposing these fees – the “Fees Rule” – went into effect in October 2018, but the obligation to pay the fees kicked in this year, as the EPA launched new risk evaluations for 20 substances. Companies should be diligent when determining the potential impacts of the Fees Rule. For starters, the EPA has opened a comment period during which companies have the opportunity to review preliminary lists of manufacturers and importers of HP substances.
The preliminary lists were developed using the most up-to-date information available, including information submitted to the EPA under the Chemical Data Reporting Rule and the Toxics Release Inventory. However, EPA has indicated that the preliminary list may not be comprehensive, and companies involved in manufacturing or importing HP substances are required to self-identify to the EPA or be subject to daily fines. Thus, it is critical for companies to undertake the necessary due diligence prior to the end of the comment period, which is May 27, 2020. If a company believes it has been listed wrongly, it should consider filing a "certification of no manufacture" or a "certification of cessation" to be removed from fee obligations. Conversely, companies that do handle these substances must self-identify or face the risk of significant penalties. The potential size of the fees is hard to estimate.
The EPA has determined that the HP risk evaluations will cost about $1.35 million per substance, and the costs will be distributed among all companies on the final list for each substance. The fees will vary from one substance to another depending on the number of impacted entities and a few other variables. For example, small businesses are expected to receive an 80 percent discount on fee obligations. Also, the Fees Rule allows entities to form consortia to divvy up the fees among themselves, a provision that is intended to ease compliance burdens for both the entities and the EPA. If a company does not join a consortium, then the EPA will dictate the fee amount it owes. What do you need to do by May 27? 1. Determine whether you are a manufacturer or importer of any of the HP substances or if you are an importer of articles containing HP substances. 2. Review the preliminary lists of manufacturers and importers of HP substances as compiled by the EPA. Your company belongs on the list if it manufacturers or imports any of the substances or if it imports articles containing HP substances. At present, there are no exclusions or exemptions for articles; there is no de minimis level for reporting; there are no volume or quantity thresholds for reporting; and there are no exclusions for byproducts and impurities. Here is some guidance should you need to know how the EPA defines “manufacturer,” “importer,” or “article.” 3. If your company is listed incorrectly, then a correction notice must be submitted during the open comment period. You can submit a comment to the open docket, or IPC can do this for you. 4. If you believe that your company needs to be listed, then you are required to self-identify through the Chemical Data Exchange (CDX) system. You will need to submit at least your company’s information and a technical point of contact. Here are some additional dates to be mindful of. It is expected that companies will have 60 days after the release of the final scoping documents to form consortia. Impacted companies will need to determine whether they want to join any consortia and to join if they wish to do so. Approximately 120 days after the final scoping documents are released, the TSCA fees will be due to EPA. What else can you do? Review the draft scoping documents for the risk evaluations. Likely beginning in April 2020, the EPA will release the draft scoping documents for each of the 20 HP substances. IPC will be tracking these documents and providing updates to its members. The scoping document is the first step in the risk evaluation process, and providing evidence-based information to the EPA about your understanding of a substance will enable the EPA to identify relevant conditions of use in the risk evaluation. Also, there should be a good correlation between uses of the HP substances that are subject to risk evaluations and those who are obligated to pay TSCA fees to support the risk evaluation. Keep in touch with IPC. Let us know your questions, concerns, and suggestions about the TSCA fee obligations. To date, IPC has engaged with the EPA senior staff responsible for implementation of the Fees Rule to voice the electronics industry’s concerns regarding self-identification for those who import articles containing HP substances. You may also sign up to receive the weekly IPC Global Advocacy Report to stay informed on this subject and all the latest electronics-relevant environmental policy happenings. Any questions? Just drop me a line.
TSCA fees apply when a company manufactures or imports HP substances, including when articles intentionally contain them, with no exemptions allowed.
Companies must review EPA’s preliminary lists and assess whether they manufacture or import HP substances or articles containing them.
The company should file a correction or certification during the comment period to avoid improper TSCA fee obligations.
EPA divides each substance’s $35 million evaluation cost among all listed companies, with discounts for small entities and consortium options.
By May 27, companies must self-identify or correct listings, with fee payments due about 120 days after final scoping documents.
TTM Technologies Inc.'s Sustainability Efforts Recognized by U.S. EPA
By Kelly Scanlon, director, environment, health and safety policy and research, IPC
Key Summary
• TTM Technologies earned EPA recognition for reducing emissions and improving printed circuit board production processes.
• The Sterling facility lowered ammonia air emissions and reduced nitrate compounds discharged to the local water treatment facility.
• TTM promotes sustainable chemical and material choices, reducing off-site transfers of lead and copper sent for recycling.
• The company installed a new Ion Exchange wastewater system to improve water footprint and metal recovery efficiency.
Kudos to IPC-member company TTM Technologies, Inc. for reducing air and water emissions while continuously improving their printed circuit board production processes. On February 11, 2020, the Sterling, Va. facility was recognized by the U.S. Environmental Protection Agency (EPA) Regional Administrator and the Region 3 Director for Land, Chemicals, and Redevelopment Division for these improvements as demonstrated by the Toxics Release Inventory data from 2018. TTM’s Sterling facility has optimized production processes resulting in reduced air emissions of ammonia and reduced quantities of nitrate compounds discharged to the local water treatment facility. In addition, TTM educates it customers and staff about chemical and material selections resulting in reduced off-site transfers of lead and copper sent for recycling. The company is passionate about what it makes as well as how sustainably it makes it. Printed circuit board fabrication in the United States is essential to defense systems and other critical applications. Producing these essential products reliably and without increased cost to the environment is a challenge that TTM Technologies has taken head on. “TTM’s lean management system enables them to demonstrate continuous improvement across all that they do and the Sterling facility is no exception,” said Chris Mitchell, IPC vice president of global government relations. Across the United States, TTM is investing its capital and engineering intelligence -- the skills of its own employees, to design, fabricate, and install new Ion Exchange (IX) wastewater treatment systems. In 2019, the Sterling facility’s IX system came online and it is expected that this will further improve the company’s water footprint through increased capacity and improved metal recovery efficiency. IPC worked with the Sterling facility staff to host the EPA’s Smart Sectors Program and Toxic Substances Control Act (TSCA) staff for a tour of the new IX system in July 2019. Read more here. We look forward to this facility’s and this company’s efforts to shape and define achievable sustainability goals.
TTM reduced ammonia air emissions, lowered nitrate discharges to the local water facility and improved recycling efforts for lead and copper.
EPA recognized the Sterling facility for demonstrating emissions reductions and continuous improvement shown in its 2018 Toxics Release Inventory data.
The company has optimized production processes, educated customers and staff on material choices and invested in advanced wastewater treatment systems.
The Ion Exchange system increases wastewater treatment capacity and improves metal recovery efficiency, further reducing the facility’s water footprint.
Key Takeaways from IPC APEX EXPO 2020 from a Government Relations Perspective
Delta Group Electronics Hosts Production of IPC Wire Crimping Video
By Mark Pritchard, director, media training.
Key Summary
• Delta Group Electronics hosted production of IPC’s new Wire Crimping training video in December 2019
• This marks the sixth IPC video produced with Delta Group Electronics, four of which previously won training awards
• The Dallas team provided extensive planning, technical support and sample preparation for the production
• Key contributors included production staff, engineering support and leadership who coordinated logistics and demonstrations
• New wire-crimp samples created for the video will also be used in the IPC A-620 Certificate Course
• Additional equipment and samples were supplied by Schleuniger to support the filming process
Delta Group Electronics of Dallas, Texas, hosted the production of a new IPC video on Wire Crimping, December 9-12, 2019. This is the sixth IPC video that Delta Group Electronics has hosted. Four of these videos have already won industry awards for video training:
- Safety in Electronics Assembly – Albuquerque, N.M.
- Wire Assembly Terminology Training – Rockledge, Fla.
- Electronic Assembly Inspection – Albuquerque, N.M.
- Reflow Soldering – Albuquerque, N.M.
- Handling in Electronics Assembly – Albuquerque, N.M.
- Founded in 1987, Delta Group Electronics Inc. is a full-scope electronics contract manufacturer with five facilities — serving the southern portion of the United States from coast to coast. More information can be found at www.deltagroupinc.com.
“The pre-production planning and technical support for this video was exceptional,” according to Mark Pritchard, IPC video producer. “DGEI had everything laid out and ready to demo, along with the help of their top production staff. We felt completely welcome and supported, for which we are deeply grateful.”
Participants in the video were:
Damir Cocic, production manager;
Flor Hernandez, engineering support;
Avelito Hernal, engineering.
Flor Hernandez created all of the new wire-crimp samples that will be featured in this video and in the new IPC A-620 Certificate Course. Tod Cummins, DGEI/director of corporate quality, coordinated the production with Trey Johnson, general manager of the Dallas facility. Additional tools, equipment, and samples were brought in by Jonathon Guay of Schleuniger. IPC sincerely appreciates this exceptional contribution to the educational efforts of our industry.
Subscribe to our online video library: https://my.ipcedge.org/static/vtl.html for these and other training programs from IPC..

Delta Group Electronics has a strong history of supporting IPC training productions, offering skilled staff, technical expertise and well-equipped facilities that help ensure high-quality instructional content.
This Wire Crimping video is the sixth IPC production hosted by the company, and four previous collaborations have earned industry awards for training excellence.
The new wire-crimp samples were created by Flor Hernandez from engineering support, and they will be featured in both the video and the IPC A-620 Certificate Course.
Tod Cummins coordinated planning with Trey Johnson, ensuring the facility, staff and materials were ready for filming and supporting smooth on-site production.
Yes, Schleuniger contributed tools, equipment and additional samples through Jonathon Guay to support filming needs.
Where Can you Find a Suitable Surface Finish for 5G, High Frequency, and High-Density Applications?
By Kunil Shah, Ph.D., chief scientist, LiloTree
Key Summary
• High frequency and high density electronics require surface finishes that minimize insertion loss and maintain signal integrity.
• ENIG is widely used but its nickel layer reduces performance due to higher conductor losses and ferromagnetic effects.
• Nickel’s properties can degrade high-frequency data transfer compared to bare copper surfaces.
• Selecting a finish for 5G applications requires low insertion loss, long shelf life, cost effectiveness and high reliability.
• Alternatives such as EPIG, EPAG and DIG exist, though each has limitations for advanced applications.
The advent and ongoing evolution of internet-enabled mobile devices has continued to drive innovation in the manufacturing and design of technology capable of high-frequency/high-density electronic signal transfer. The combined requirements for both fast, always-on data transmission, and small geometric form-factors can be difficult to satisfy without compromised performance and signal loss. Among the primary factors affecting the integrity of high frequency signals is the surface finish applied on PCB copper pads – a need commonly met by technology manufacturers through the electroless nickel immersion gold process, ENIG. However, a well-documented limitation of ENIG is its insertion loss due to the inferior conductivity of nickel over copper, leading to higher conductor losses. Additionally, nickel’s ferromagnetic properties adversely affect circuit performance. The result is an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper. The selection criteria of surface finish for 5G, high frequency, high density application involves minimal insertion loss, long shelf life, cost-effective and high reliability. There are few options (EPIG, EPAG, DIG, etc.) available in the market and there are limitations involved with each offering. You can learn more at IPC APEX EXPO Technical Conference Session 15 (Surface Finishes 1) on Wednesday, February 5 at 1:30-3:00 pm. For more information, visit www.ipcapexexpo.org.
ENIG introduces insertion loss because nickel has lower conductivity than copper and its ferromagnetic properties weaken circuit performance.
These applications require minimal insertion loss and high reliability to maintain fast, consistent data transmission in compact designs.
Nickel increases conductor losses and its ferromagnetic behavior negatively impacts high frequency circuit performance compared to bare copper.
A suitable finish should provide low insertion loss, long shelf life, cost effectiveness and high reliability for advanced applications.
Three Workforce Lessons from Manufacturing Plants Around the World
By John Mitchell, IPC president and CEO
Key Summary
• Global electronics manufacturers face similar workforce shortages, with hiring and retention challenges emerging across regions.
• Hiring for interest, then training internally, builds long-term talent pipelines.
• Clear career pathways increase motivation, loyalty, and workforce stability.
• Collaborative communication systems improve problem-solving, efficiency, and worker satisfaction.
• International practices offer transferable lessons for U.S. manufacturing growth.
The U.S. economy has remained surprisingly resilient, and the result has been that the country’s unemployment has continued to inch lower. It’s now at 3.5 percent, the lowest rate since 1969, and that rate could go even lower as the U.S. boasts more than 7 million job openings. Those job openings suggest an opportunity for workers but a tight labor market for employers. For the industry I represent, electronics manufacturing, talent and retention have always been top concerns, but the situation is worsening. Today, more than 60 percent of U.S. manufacturers say that an inability to find and retain skilled workers is constraining their growth and undermining their global competitiveness. The same story is true around the world. During my latest international listening tour of manufacturing plants in France, Germany, India, Japan, Taiwan and Thailand, I noted again that the challenges faced in the United States extend beyond our borders. The good news is that, through shared experience, we can develop shared insights and solutions. In that vein, I’d like to offer the conclusions I’ve drawn from my meetings with operators and managers across the electronics industry about the current labor environment: Lesson 1: An open-minded approach to hiring based on industry interest, not just skill, can result in new long-term talent During the recruitment process, seeking out potential employees that hold genuine interest and passion for the industry even if they don’t yet pose the skills can provide a new source to fill long-term workforce gaps. It’s okay to hire an employee with minimal training – that's where company education programs come in. In Japan, one manufacturing plant hires operators interested in the job without a background in the industry. The workers are trained with pay for a full year before joining the assembly line. Once thoroughly vetted and trained, operators have the avenue to move up through the ranks to become managers. Among the factory managers with whom I spoke, none of them had college-level training; their education was solely completed through intracompany training. As an added bonus the longevity and loyalty of this workforce is impressive, but more on that in Lesson 3. This model, used in some Japanese companies as well as others in Europe, underscores the point that we can find talent by embracing workers with little to no experience – but with industry passion – to build the worker pipeline. That is where the next key lesson comes in. Lesson 2: Career progression is important to workers Hiring is the first step, but companies need to keep thinking of new ways to keep employees engaged and motivated by prioritizing both their personal and professional growth. Job security and location to home remain pillars for workers within the industry. However, with a younger generation entering the workforce, convenience isn’t enough to retain workers. Workers want to know they have a career path they can build in their companies. In Thailand, operators who lack a college education, along with management staff from top schools, can grow within their roles and continuously be promoted. The job culture there exposes workers early on to self-improvement paths that help them attain specific knowledge or capabilities. Having this type of transparency helps create trust among employees and companies, where the workers invest in the companies and the companies invest in the workers. During my latest trip, I spoke with college-educated engineers who expressed appreciation for their companies’ focus on personal growth. One manager emphasized that it was during his time as a quality engineer that he learned how to meet his goals and prioritize learning additional skill areas, allowing him to become a senior production manager. Lesson 3: Worker retention relies on effective workplace communication to maintain worker happiness As I engage with workers and management, I’m always reminded that companies address and troubleshoot challenges in the workplace in a variety of ways, and how they do so impacts the employee experience. A successful environment champions collaboration to lessen the stress placed upon employees closest to the supply chain or any other production issues at hand. In Bangalore, India, I saw how deliberate and collaborative employee interaction could solve product processing challenges. For more arduous job tasks, such as accommodating factory capacity, maintaining various product delivery schedules and facilitating cross-department collaboration, a company systemized procedure review. When they encounter an issue, operators stop the production process, brainstorm solutions, bring these potential solutions to a quality assurance team and then implement the changes through a management system in place, fostering a new type of learning environment with its people and collaborative problem-solving at the core. The success this brings isn’t just apparent through workers’ happiness and loyalty – their mantra of “zero defects,” helps ensure their products demonstrate the highest quality standards through their production process. Conclusion: Lessons can be learned on a global stage to ensure company efficiencies and worker satisfaction for future growth Seven million jobs unfilled is a staggering number, but U.S. economic growth and innovation hinges upon addressing this workforce need. Companies are stepping up through commitments to hire interested but untrained workers, employee initiatives geared toward career progression, and c-suite focus on finding ways to retain workers. These initiatives are helping to drive record growth in the electronics industry. But the U.S. industry should take note of the lessons I saw around the world. For too long, countries have been resistant to learn lessons from others. But with our ever-shrinking globe and ever-expanding workforce, our neighbors have solutions that should be embraced.
Hiring based on genuine interest allows employers to train workers internally and build loyalty. Examples from Japan and Europe show that employees with little experience can become highly capable when supported through structured, paid training programs designed to develop long-term talent.
Employees stay engaged when they can see a future within the company. Plants in Thailand and other regions show that offering clear advancement paths and promoting personal growth helps workers build careers rather than short-term jobs, which increases loyalty and reduces turnover.
Manufacturers that encourage open communication and collaborative problem solving create more supportive environments. Systems that allow operators to pause production, share issues and propose solutions improve product quality, reduce stress and help workers feel valued and respected.
Across France, Germany, India, Japan, Taiwan and Thailand, manufacturers described tightening labor markets and difficulty finding skilled labor. Despite regional differences, companies consistently highlighted hiring, training and retention as central challenges that directly affect competitiveness and growth.
Global examples show that proactive training, clear advancement pathways and strong communication systems are effective tools for building stable workforces. These lessons can help U.S. manufacturers strengthen retention, improve efficiency and adapt to a labor market with millions of unfilled jobs.
U.S. Congress to Approve Funds for R&D on Lead-free Electronics in Aerospace, Defense and High-performance Applications
Key Summary
• Congress is set to approve $5 million for R&D on lead-free electronics in mission-critical aerospace and defense applications.
• The electronics industry has largely phased out lead, but ADHP sectors rely on exemptions due to reliability concerns.
• The gap between commercial and defense electronics is widening as lead-free adoption accelerates globally.
• IPC says public-private R&D is needed to ensure reliable access to advanced electronics for mission-critical systems.
• IPC and partners support a long-term investment strategy to reduce costs and strengthen defense readiness.
In a win for U.S. taxpayers, defense readiness, and the electronics industry supply chain, the U.S. House and Senate are poised this week to approve a defense spending bill that includes $5 million for research and development on the issues surrounding lead-free electronics in mission-critical applications. IPC and dozens of its members and allies supported the request for these funds, which are included in the final version of the Fiscal 2020 defense appropriations bill, being voted upon in the U.S. Senate today. The House has already approved the spending package, and President Trump is expected to sign the measure within hours after its passage. Over the last 15 years, the commercial electronics industry has largely phased out its use of lead (Pb) in the manufacture of electronic components and circuit assemblies, due to government regulations driven by lead’s harmful effects on human health and the environment. However, the aerospace, defense and high-performance (ADHP) electronics sectors have secured exceptions to these restrictions because there is not enough data to guarantee the reliability of lead-free components in ADHP applications. The lead-free gap between commercial and defense electronics will only grow as lead-free becomes more entrenched in cutting-edge commercial technologies, and as governments – especially the European Commission – seek even more stringent rules on the use of lead. “The migration of the commercial industry to lead-free electronics has introduced technical and supply-chain concerns in the aerospace, defense and high-performance sectors that can only be addressed through greater, more focused public-private R&D,” said Chris Mitchell, IPC vice president of global government relations. “The funds in this bill will help support the much-needed collective effort and help ensure that mission-critical systems have full access to cutting-edge electronics from a robust global supply chain.” “Together with our partners in the Pb-Free Electronics Risk Management (PERM) Council, IPC will continue to advocate for a proactive, long-term approach to this issue,” Mitchell added. IPC and its partners believe that a five-year, $40 million investment in a public-private R&D program would yield more than $100 million in U.S. defense savings per year and improve military readiness and overall innovation. For more information, read this IPC Blog from April 2019.
Congress is approving funds to study reliability issues that arise when using lead-free electronics in mission-critical aerospace and defense systems.
These sectors lack sufficient data to confirm that lead-free components can reliably perform in high-risk ADHP applications.
Commercial electronics are rapidly moving to lead-free processes, widening the technology and supply-chain gap with ADHP sectors that cannot fully adopt them.
IPC believes focused R&D is essential to address technical and supply-chain risks and ensure mission-critical systems can access advanced electronics.
U.S. Congress to Approve Funds for R&D on Lead-Free Electronics and Defense
By Chris Mitchell, vice president, global government relations
Key Summary
• Congress is poised to approve $5 million for R&D on lead-free electronics in mission-critical defense applications
• The aerospace, defense, and high-performance sectors lack sufficient reliability data to fully transition to lead-free technologies
• The commercial electronics industry has already moved largely to lead-free materials due to health and environmental concerns
• IPC and nearly 30 partners advocated for this funding as seed money for a larger multiyear R&D effort
• IPC supports a long-term public-private program to close the lead-free data gap and strengthen U.S. defense readiness
In a win for U.S. taxpayers, defense readiness, and the electronics industry supply chain, the U.S. House and Senate are poised this week to approve a defense spending bill that includes $5 million for research and development on the issues surrounding lead-free electronics in mission-critical applications. President Trump is expected to sign the measure within hours after its passage. IPC and nearly 30 of its members and allies lobbied for these funds, which are “seed money” for a longer-term R&D effort. The need for these funds may be unfamiliar to the general public, but for the aerospace and defense industries, especially, this is a big deal. Over the last 15 years, the commercial electronics industry has largely phased out its use of lead (Pb) in the manufacture of electronic components and circuit assemblies, due to lead’s harmful effects on human health and the environment. However, the aerospace, defense and high-performance (ADHP) electronics sectors have been reluctant to migrate to lead-free because there is not enough data on the reliability of lead-free components in such applications. The lead-free gap between commercial and defense electronics will only grow as lead-free becomes more entrenched in cutting-edge commercial technologies, and as governments – especially the European Commission – seek even more stringent rules on the use of lead. IPC believes a five-year, $40 million investment in a public-private R&D program would yield more than $100 million in U.S. defense savings per year and improve military readiness and overall innovation.
Together with our partners in the Pb-Free Electronics Risk Management (PERM) Council, comprised of experts from government, industry, academia, and other stakeholders, IPC will continue to advocate for a robust, long-term approach to this issue. Read our April 2019 blog for even more background, and watch this space and IPC.org for updates.
Lead-free materials are widely used commercially, but defense and aerospace programs lack sufficient reliability data for mission-critical uses. Funding supports research needed to ensure lead-free components can perform safely and consistently in high-stress defense environments.
These sectors rely on proven reliability, yet there is limited data on how lead-free components behave under demanding conditions. As commercial technologies move further into lead-free manufacturing, the performance gap between commercial and defense electronics continues to widen.
The funding serves as seed money for a broader R&D initiative aimed at understanding and mitigating risks associated with lead-free electronics in mission-critical systems. It supports early research that could eventually lead to large-scale testing and standards development.
IPC estimates that a sustained five-year, $40 million program could save the U.S. more than $100 million annually by improving readiness and reducing failures. Long-term investment is needed to address risks, modernize defense systems, and keep pace with commercial innovation.
The PERM Council brings together experts from government, industry, and academia to guide research priorities, assess risks, and advocate for coordinated approaches. Their work helps ensure that R&D efforts address real-world challenges across the defense electronics ecosystem.